ORTHODONTIC APPLIANCES HAVING A CONTOURED BONDING SURFACE
    2.
    发明申请
    ORTHODONTIC APPLIANCES HAVING A CONTOURED BONDING SURFACE 审中-公开
    具有表面结合表面的正交电极

    公开(公告)号:WO2004098439A1

    公开(公告)日:2004-11-18

    申请号:PCT/US2004/011142

    申请日:2004-04-12

    IPC分类号: A61C7/14

    摘要: A quantity of a photocurable composition, such as an orthodontic adhesive containing a photoinitiator, is placed between the base of an orthodontic appliance and a replica of a patient's tooth structure. The replica is made using a material that transmits actinic radiation. As the appliance is pressed into firm contact with the replica tooth structure, an outer surface of the photocurable composition assumes the configuration of the underlying portion of the replica tooth structure. Actinic radiation is then directed to the photocurable composition, and at least part of the actinic radiation is directed through the replica tooth model in order to harden the photocurable composition. The hardened composition provides a contoured bonding surface having a shape that matches corresponding regions of the patient's tooth structure. Methods are also disclosed for making an orthodontic indirect bonding transfer apparatus for use with appliances having a contoured bonding surface.

    摘要翻译: 将一定量的可光固化组合物,例如含有光引发剂的正牙粘合剂放置在正畸器具的基座和患者牙结构的复制品之间。 复制品是使用透射光化辐射的材料制成的。 当器具被压制成与复制齿结构牢固接触时,可光固化组合物的外表面呈现复制齿结构的下面部分的构型。 然后将光化辐射引导到可光固化组合物,并且至少部分光化辐射被引导通过复制齿模型以使光固化组合物硬化。 硬化的组合物提供具有匹配患者牙结构的相应区域的形状的轮廓结合表面。 还公开了用于制造用于具有轮廓结合表面的器具的正牙直接接合转移装置的方法。

    METHOD AND APPARATUS FOR INDIRECT BONDING OF ORTHODONTIC APPLIANCES

    公开(公告)号:WO2004098440A3

    公开(公告)日:2004-11-18

    申请号:PCT/US2004/011689

    申请日:2004-04-15

    IPC分类号: A61C7/14

    摘要: An indirect bonding apparatus is made by initially placing spacer material over a replica (20) of the patient's tooth structure. A tray (30) is then formed over the spacer material and hardened. Next, the spacer material is removed from the tooth replica and orthodontic appliances (34) are placed on the replica at desired locations. A matrix material (40) is placed between the tray and the replica and allowed to harden. Optionally, the apparatus includes features for facilitating removal of the transfer apparatus after the bonding procedure has been completed, and features for applying firm, uniform pressure to the appliances during the bonding procedure. Other aspects of indirect bonding are also described.