Invention Application
WO2005037907A1 COATINGS AND HARD MASK COMPOSITIONS FOR INTEGRATED CIRCUIT APPLICATIONS, METHODS OF PRODUCTION AND USES THEREOF
审中-公开
用于集成电路应用的涂层和硬掩模组合物，其生产方法及其用途
- Patent Title: COATINGS AND HARD MASK COMPOSITIONS FOR INTEGRATED CIRCUIT APPLICATIONS, METHODS OF PRODUCTION AND USES THEREOF
- Patent Title (中): 用于集成电路应用的涂层和硬掩模组合物，其生产方法及其用途
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Application No.: PCT/US2004/032789Application Date: 2004-10-05
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Publication No.: WO2005037907A1Publication Date: 2005-04-28
- Inventor: KENNEDY, Joseph , HUANG, Wei, T. , DO, Kim, N. , STUCK, Jason
- Applicant: HONEYWELL INTERNATIONAL INC. , KENNEDY, Joseph , HUANG, Wei, T. , DO, Kim, N. , STUCK, Jason
- Applicant Address: 101, Columbia Road, Morristown, NJ 07962 US
- Assignee: HONEYWELL INTERNATIONAL INC.,KENNEDY, Joseph,HUANG, Wei, T.,DO, Kim, N.,STUCK, Jason
- Current Assignee: HONEYWELL INTERNATIONAL INC.,KENNEDY, Joseph,HUANG, Wei, T.,DO, Kim, N.,STUCK, Jason
- Current Assignee Address: 101, Columbia Road, Morristown, NJ 07962 US
- Agency: THOMPSON, Sandra, P.
- Priority: US60/509 20031007
- Main IPC: C08K3/22
- IPC: C08K3/22
Abstract:
A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.
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