COATINGS AND HARD MASK COMPOSITIONS FOR INTEGRATED CIRCUIT APPLICATIONS, METHODS OF PRODUCTION AND USES THEREOF
    1.
    发明申请
    COATINGS AND HARD MASK COMPOSITIONS FOR INTEGRATED CIRCUIT APPLICATIONS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
    用于集成电路应用的涂层和硬掩模组合物,其生产方法及其用途

    公开(公告)号:WO2005037907A1

    公开(公告)日:2005-04-28

    申请号:PCT/US2004/032789

    申请日:2004-10-05

    CPC classification number: C09D183/04

    Abstract: A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.

    Abstract translation: 本文描述了包括至少一种无机化合物和至少一种致密化剂的涂层材料,其中与至少一种无机化合物的密度相比,致密化剂增加了涂层材料的密度。 本文描述了制备涂料的方法,其包括:提供至少一种无机化合物,提供至少一种致密化剂,将至少一种无机化合物与至少一种致密化剂结合以形成涂层材料,其中致密化 与至少一种无机化合物的密度相比,增加了涂层材料的密度。

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