Invention Application
- Patent Title: METHOD AND DEVICE FOR REFLOW SOLDERING WITH VOLUME FLOW CONTROL
- Patent Title (中): 方法和装置回流的流量控制
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Application No.: PCT/EP2004012262Application Date: 2004-10-29
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Publication No.: WO2005043758A3Publication Date: 2005-08-11
- Inventor: BELL HANS
- Applicant: REHM ANLAGENBAU GMBH , BELL HANS
- Assignee: REHM ANLAGENBAU GMBH,BELL HANS
- Current Assignee: REHM ANLAGENBAU GMBH,BELL HANS
- Priority: DE10350699 2003-10-30
- Main IPC: B23K1/008
- IPC: B23K1/008 ; H05K3/34
Abstract:
According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.
Information query
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