The invention relates to a method of aligning semiconductor devices in die stacking and a semiconductor structure fabricated by the method. In stacking a die on a wafer, for example, a first semiconductor device on the wafer and a second semiconductor device on the die are aligned by a magnetic force between at least a first magnetic body belonging to the wafer and at least a second magnetic body belonging to the die. After the alignment, the die is made not to move by the magnetic force between the magnetic bodies to maintain the alignment which is necessary for the fabrication of a semiconductor structure.