Invention Application
- Patent Title: CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE
- Patent Title (中): 电路板结构及制造电路板结构的方法
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Application No.: PCT/FI2006000207Application Date: 2006-06-15
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Publication No.: WO2006134216A3Publication Date: 2007-07-05
- Inventor: TUOMINEN RISTO , IIHOLA ANTTI , PALM PETTERI
- Applicant: IMBERA ELECTRONICS OY , TUOMINEN RISTO , IIHOLA ANTTI , PALM PETTERI
- Assignee: IMBERA ELECTRONICS OY,TUOMINEN RISTO,IIHOLA ANTTI,PALM PETTERI
- Current Assignee: IMBERA ELECTRONICS OY,TUOMINEN RISTO,IIHOLA ANTTI,PALM PETTERI
- Priority: FI20050646 2005-06-16
- Main IPC: H05K3/20
- IPC: H05K3/20 ; H01L21/48 ; H01L21/60 ; H01L23/13 ; H01L23/538 ; H01L23/544 ; H05K20060101 ; H05K1/18 ; H05K3/28 ; H05K3/30 ; H05K3/32 ; H05K3/40
Abstract:
The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil (2) and a conductor pattern (6) on the surface of the conductor foil. A component (9) is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern (6).
Information query
