Invention Application
WO2007009365A1 化学机械抛光液
审中-公开
- Patent Title: 化学机械抛光液
- Patent Title (English): Chemical mechanical polishing liquid
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Application No.: PCT/CN2006/001702Application Date: 2006-07-17
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Publication No.: WO2007009365A1Publication Date: 2007-01-25
- Inventor: 杨春晓 , 俞昌 , 肖正龙 , 荆建芬
- Applicant: 安集微电子(上海)有限公司 , 杨春晓 , 俞昌 , 肖正龙 , 荆建芬
- Applicant Address: 中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 201203 CN
- Assignee: 安集微电子(上海)有限公司,杨春晓,俞昌,肖正龙,荆建芬
- Current Assignee: 安集微电子（上海）有限公司,杨春晓,俞昌,肖正龙,荆建芬
- Current Assignee Address: 中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 201203 CN
- Agency: 上海虹桥正瀚律师事务所
- Priority: CN200510027990.9 20050721
- Main IPC: C09G1/02
- IPC: C09G1/02
Abstract:
A chemical mechanical polishing liquid, comprising at least an abrasive particle, a chemical additive and a carrier material, wherein the chemical additive is polycarboxylic acid or the salt thereof. Said polishing liquid is used to considerably reduce the defective rate, to increase the flatness level of the metal surface, to reduce polishing rate of metal, to optimize the polishing rate of dielectric, and to extend the range of process parameter.
Information query
