Invention Application
- Patent Title: METHOD AND DEVICE FOR LAYING THIN WIRE
- Patent Title (中): 方法和设备铺设细线
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Application No.: PCT/EP2007058204Application Date: 2007-08-07
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Publication No.: WO2008017682A2Publication Date: 2008-02-14
- Inventor: ULRICH REINHARD , FLOECK THOMAS
- Applicant: MUEHLBAUER AG , ULRICH REINHARD , FLOECK THOMAS
- Assignee: MUEHLBAUER AG,ULRICH REINHARD,FLOECK THOMAS
- Current Assignee: MUEHLBAUER AG,ULRICH REINHARD,FLOECK THOMAS
- Priority: DE102006037093 2006-08-07
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K7/06
Abstract:
The invention relates to a method and a device for laying thin wire. During the automatic laying of wire onto a substrate, the wire that is pre-coated with adhesive has to be pressed tightly against the substrate without damaging the wire. This becomes increasingly difficult with decreasing wire diameters (
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