Invention Application
WO2008094714A1 VARIED SOLDER MASK OPENING DIAMETERS WITHIN A BALL GRID ARRAY SUBSTRATE
审中-公开
在球网阵列底座上的变化的焊接面罩打开直径
- Patent Title: VARIED SOLDER MASK OPENING DIAMETERS WITHIN A BALL GRID ARRAY SUBSTRATE
- Patent Title (中): 在球网阵列底座上的变化的焊接面罩打开直径
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Application No.: PCT/US2008/050009Application Date: 2008-01-02
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Publication No.: WO2008094714A1Publication Date: 2008-08-07
- Inventor: CARPENTER, Burton J. , LANGFORD, Patrice L. , LINDSAY, Wayne S. , LOW, Boon Yew
- Applicant: FREESCALE SEMICONDUCTOR INC. , CARPENTER, Burton J. , LANGFORD, Patrice L. , LINDSAY, Wayne S. , LOW, Boon Yew
- Applicant Address: 6501 William Cannon Drive West Austin, Texas 78735 US
- Assignee: FREESCALE SEMICONDUCTOR INC.,CARPENTER, Burton J.,LANGFORD, Patrice L.,LINDSAY, Wayne S.,LOW, Boon Yew
- Current Assignee: FREESCALE SEMICONDUCTOR INC.,CARPENTER, Burton J.,LANGFORD, Patrice L.,LINDSAY, Wayne S.,LOW, Boon Yew
- Current Assignee Address: 6501 William Cannon Drive West Austin, Texas 78735 US
- Agency: KING, Robert L. et al.
- Priority: US11/668,689 20070130
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/28 ; H01R12/00
Abstract:
A packaging assembly (29), such as a ball grid array package, is formed to reduce the effects of warpage by varying the size of solder ball aperture openings in the solder mask layer so that smaller solder ball aperture openings are located on the carrier substrate (20) areas where warpage is higher and larger solder ball aperture openings are located on the carrier substrate where warpage is lower.
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