Invention Application
- Patent Title: HEAT SINK, AND ASSEMBLY OR MODULE UNIT COMPRISING A HEAT SINK
- Patent Title (中): 散热器和建或模块单元的带散热器
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Application No.: PCT/DE2007002186Application Date: 2007-12-04
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Publication No.: WO2008119309A3Publication Date: 2009-02-19
- Inventor: HAMMEL ERNST , SCHULZ-HARDER JUERGEN
- Applicant: ELECTROVAC AG , HAMMEL ERNST , SCHULZ-HARDER JUERGEN
- Assignee: ELECTROVAC AG,HAMMEL ERNST,SCHULZ-HARDER JUERGEN
- Current Assignee: ELECTROVAC AG,HAMMEL ERNST,SCHULZ-HARDER JUERGEN
- Priority: DE102007015771 2007-03-30; DE102007027991 2007-06-14
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01S5/024
Abstract:
Disclosed is a heat sink for cooling parts, subassemblies, modules, or similar components, particularly for cooling electrical or electronic components. Said heat sink comprises at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in said cooling area.
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