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    METHOD FOR THE PRODUCTION OF PELTIER MODULES, AND PELTIER MODULE
    1.
    发明申请
    METHOD FOR THE PRODUCTION OF PELTIER MODULES, AND PELTIER MODULE 审中-公开
    的生产方法Peltier模块和珀尔贴模型

    公开(公告)号：WO2007098736A2

    公开(公告)日：2007-09-07

    申请号：PCT/DE2007000342

    申请日：2007-02-20

    Applicant: CURAMIK ELECTRONICS GMBH ,  SCHULZ-HARDER JUERGEN

    Inventor： SCHULZ-HARDER JUERGEN

    IPC: H01L35/08 ,  H01L35/34

    CPC classification number: H01L35/34 ,  H01L35/08

    Abstract: The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal surfaces during the production process, are formed by metallic areas.

    Abstract translation: 本发明涉及一种用于珀耳帖模块，每个模块具有多个设置在至少两个基板珀耳帖元件之间的制造方法，其中，所述基材至少包括在其面对的电绝缘材料的珀耳帖元件侧面和与金属此表面侧 形成的接触表面区域设置，与该珀耳帖元件串联连接在垫的制造。

    COOLING SYSTEM FOR ELECTRONIC DEVICES AND DEVICE WITH SUCH A COOLING SYSTEM
    2.
    发明申请
    COOLING SYSTEM FOR ELECTRONIC DEVICES AND DEVICE WITH SUCH A COOLING SYSTEM 审中-公开
    具有这种冷却系统的电子设备和设备的冷却系统

    公开(公告)号：WO2005088429A3

    公开(公告)日：2005-10-27

    申请号：PCT/DE2005000246

    申请日：2005-02-14

    Applicant: CURAMIK ELECTRONICS GMBH ,  SCHULZ-HARDER JUERGEN ,  WILLER BERND

    Inventor： SCHULZ-HARDER JUERGEN ,  WILLER BERND

    IPC: G06F1/20 ,  H01L23/40 ,  H01L23/473 ,  H05K7/20

    CPC classification number: H05K7/20272 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a novel cooling system for electronic components in an electronic device, for example a computer or a PC, whereby the cooling system comprises at least one cooler (5), for fixing to a component (2) for cooling, in a closed circuit for a liquid cooling medium and further components connected, for example, by means of hose lines (8, 9, 11) such as at least one heat exchanger unit (13) for fixing to a ventilation opening in a device housing (4), comprising at least one heat exchanger (10, 10a, 10b), at least one reservoir (6) for the liquid cooling medium and at least one circulating pump (7).

    Abstract translation: 本发明涉及一种新的冷却系统，用于电子设备的电气组件，诸如计算机或PC，其中，在用于液体冷却介质的至少一个封闭回路中的冷却系统，以被紧固到该部件被冷却（2），冷却器（5），和 更多例如 经由软管线（8,9，11）相关联的组件，例如一个装置外壳（4）的通风孔中的至少一个附接至热交换器单元（13）与至少一个热交换器（10，10A，10B），至少一个存储箱（6）液体为 有冷却介质和至少一个循环泵（7）。

    COOLING DEVICE FOR LEADING DISSIPATED HEAT AWAY FROM AN ELECTRICAL OR ELECTRONIC COMPONENT OR ASSEMBLY GROUPS
    3.
    发明申请
    COOLING DEVICE FOR LEADING DISSIPATED HEAT AWAY FROM AN ELECTRICAL OR ELECTRONIC COMPONENT OR ASSEMBLY GROUPS 审中-公开
    COOLER去除热量的电气损失或电子部件或部件

    公开(公告)号：WO2005011349A3

    公开(公告)日：2005-07-07

    申请号：PCT/DE2004001440

    申请日：2004-07-06

    Applicant: SCHULZ-HARDER JUERGEN

    Inventor： SCHULZ-HARDER JUERGEN

    IPC: F25B21/02 ,  H01L23/38 ,  H01L23/40 ,  H01L23/473 ,  H01L35/00 ,  H05K7/20

    CPC classification number: H01L23/473 ,  F25B21/02 ,  H01L23/38 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a novel design of a cooling device for leading dissipated heat away from an electrical or electronic component or from assembly groups to a spatially distant outer cooler, comprising a coolant circuit, which is provided between the component or the assembly group and the outer cooler and which has at least one primary cooler. This primary cooler can be flowed through by the coolant for absorbing the dissipated heat of the component or assembly group. The cooling device also comprises at least one secondary cooler, which can be flowed through by the coolant, and comprises at least one Peltier cooler that is placed in a heat transfer section between the component or the assembly group and the outer cooler.

    Abstract translation: 本发明涉及一种新的Ausbiludng的冷却装置用于消散电气或电子元件或组件的热损失到空间远程外部冷却器，与所述部件或组件和具有至少一个通流冷却剂一次冷却器的用于外部冷凝器冷却剂回路之间的设置 接收所述组件或组件的热损失和具有至少一个通流从二次冷却剂散热器，以及具有至少一个布置在所述部件或组件和外部冷却器珀耳帖冷却器之间的热传递路径。

    ELECTRONIC DEVICE
    6.
    发明申请
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号：WO2011000360A3

    公开(公告)日：2011-03-17

    申请号：PCT/DE2010000745

    申请日：2010-06-29

    Applicant: ELECTROVAC AG ,  SCHULZ-HARDER JUERGEN ,  MEYER ANDREAS

    Inventor： SCHULZ-HARDER JUERGEN ,  MEYER ANDREAS

    IPC: H01L23/373

    CPC classification number: H01L23/3735 ,  H01L2224/32 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The invention relates to an electronic device, in particular an electronic circuit or electronic module, comprising at least one metal insulating layer substrate consisting of at least one insulating layer and at least one first metallization on a surface side of the insulating layer, wherein the first metallization of the metal insulating layer substrate is structured for forming metallization regions, and further comprising at least one electrical or electronic component on a first metallization region of the first metallization and producing lost heat, wherein the first metallization region comprises on a partial region, with which the component is at least thermally connected, a layer thickness that is substantially greater than the layer thickness of the first metallization region outside said first partial region.

    Abstract translation: 电子设备，特别是电子电路或电子模块与至少一个现有的至少一个绝缘层和至少在所述绝缘层MetallIsolierschicht基板的表面侧上的第一金属化被构造用于金属化的形成的第一金属化，并产生至少一个热损失电气或 在所述第一金属布线的第一金属化区域的电子部件，在一个局部区域，通过该组分是至少热连接所述第一金属化区域，具有层厚度比所述第一金属化区域的该第一部分区域外部的层厚度大得多。

    COOLING DEVICE FOR DISSIPATING THERMAL LOSSES FROM AN ELECTRIC OR ELECTRONIC COMPONENT OR A SUB-ASSEMBLY AND COOLER
    10.
    发明申请
    COOLING DEVICE FOR DISSIPATING THERMAL LOSSES FROM AN ELECTRIC OR ELECTRONIC COMPONENT OR A SUB-ASSEMBLY AND COOLER 审中-公开
    COOLER去除热量的电气或电子元件或组件和冷却器的损失

    公开(公告)号：WO2005015633A3

    公开(公告)日：2005-03-17

    申请号：PCT/DE2004001441

    申请日：2004-07-06

    Applicant: CURAMIK ELECTRONICS GMBH ,  SCHULZ-HARDER JUERGEN ,  EXEL KARL ,  BAUMEISTER INGO

    Inventor： SCHULZ-HARDER JUERGEN ,  EXEL KARL ,  BAUMEISTER INGO

    IPC: H01L23/473 ,  H01L23/367

    CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a novel device for dissipating the thermal losses of an electric or electronic component or a sub-assembly to a remote external cooler. Said device comprises a coolant circuit between the component or sub-assembly and the external cooler. The circuit contains at least one primary cooler that is traversed by the coolant and absorbs the thermal losses of the component or sub-assembly and at least one secondary cooler in the external cooler that is traversed by the coolant, said secondary cooler comprising a plurality of cooling fins.

    Abstract translation: 本发明涉及一种用于从电气或电子组件的去除废热或装配到空间远程外部冷却器的新颖装置，与所述部件或组件和具有至少一个通流冷却剂初级辐射器的外部冷凝器的冷却剂回路，用于接收之间所提供的 该部件的或组件的热损失和具有至少一个通流在外部冷却器冷却剂第二散热器，其中，所述二次冷却器多个冷却肋。

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