Invention Application
- Patent Title: METALLIZATION WITH TAILORABLE COEFFICIENT OF THERMAL EXPANSION
- Patent Title (中): 具有可热膨胀系数的金属化
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Application No.: PCT/US2008/061738Application Date: 2008-04-28
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Publication No.: WO2008134615A2Publication Date: 2008-11-06
- Inventor: RUBEN, David A.
- Applicant: MEDTRONIC, INC. , RUBEN, David A.
- Applicant Address: 710 Medtronic Parkway MS LC340 Minneapolis, Minnesota 55432 US
- Assignee: MEDTRONIC, INC.,RUBEN, David A.
- Current Assignee: MEDTRONIC, INC.,RUBEN, David A.
- Current Assignee Address: 710 Medtronic Parkway MS LC340 Minneapolis, Minnesota 55432 US
- Agency: BARRY, Carol F. et al.
- Priority: US11/741,593 20070427
- Main IPC: A61B5/02
- IPC: A61B5/02
Abstract:
The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.
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