Invention Application
WO2009011752A3 MICROELECTRONIC PACKAGE ELEMENT AND METHOD OF FABRICATING THEREOF
审中-公开
微电子封装元件及其制造方法
- Patent Title: MICROELECTRONIC PACKAGE ELEMENT AND METHOD OF FABRICATING THEREOF
- Patent Title (中): 微电子封装元件及其制造方法
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Application No.: PCT/US2008008134Application Date: 2008-06-27
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Publication No.: WO2009011752A3Publication Date: 2009-03-26
- Inventor: HABA BELGACEM
- Applicant: TESSERA INC , HABA BELGACEM
- Assignee: TESSERA INC,HABA BELGACEM
- Current Assignee: TESSERA INC,HABA BELGACEM
- Priority: US82767607 2007-07-12
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
Microelectronic package elements (202) and packages (280) having dielectric layers (220) and methods (100) of fabricating such elements (202) and packages (280) are disclosed. The elements (202) and packages (280) may advantageously be used in microelectronic assemblies having high routing density.
Information query
IPC分类:
