公开(公告)号：WO2013019541A4

公开(公告)日：2013-05-30

申请号：PCT/US2012048288

申请日：2012-07-26

Applicant: TESSERA INC ,  MOHAMMED ILYAS ,  HABA BELGACEM ,  UZOH CYPRIAN

Inventor： MOHAMMED ILYAS ,  HABA BELGACEM ,  UZOH CYPRIAN

IPC: H01L21/768 ,  H01L23/48

CPC classification number: H01L23/5226 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/5329 ,  H01L2224/10135 ,  H01L2924/07811 ,  H01L2924/00

Abstract: A component 10 can include a substrate 20 having a front surface 22 and a rear surface 21 remote therefrom, an opening 30 extending from the rear surface towards the front surface, and a conductive via 40 extending within the opening. The substrate 20 can have a CTE less than 10 ppm/°C. The opening 30 can define an inner surface 31 between the front and rear surfaces 22, 21. The conductive via 40 can include a first metal layer 41 overlying the inner surface 31 and a second metal region 42 overlying the first metal layer and electrically coupled to the first metal layer. The second metal region 42 can have a CTE greater than a CTE of the first metal layer 41. The conductive via 40 can have an effective CTE across a diameter D of the conductive via that is less than 80% of the CTE of the second metal region 42.

Abstract translation: 部件10可以包括具有前表面22和远离其的后表面21的基板20，从后表面朝向前表面延伸的开口30以及在开口内延伸的导电通孔40。 基板20可以具有小于10ppm /℃的CTE。 开口30可以在前表面22和后表面21之间限定内表面31.导电通孔40可以包括覆盖在内表面31上的第一金属层41和覆盖第一金属层的第二金属区域42，并且电耦合到 第一个金属层。 第二金属区域42可以具有大于第一金属层41的CTE的CTE。导电通孔40可以具有穿过导电通孔的直径D的有效CTE，其小于第二金属的CTE的80％ 区域42。

公开(公告)号：WO2013019541A3

公开(公告)日：2013-04-18

申请号：PCT/US2012048288

申请日：2012-07-26

Applicant: TESSERA INC ,  MOHAMMED ILYAS ,  HABA BELGACEM ,  UZOH CYPRIAN

Inventor： MOHAMMED ILYAS ,  HABA BELGACEM ,  UZOH CYPRIAN

IPC: H01L21/768 ,  H01L23/48

CPC classification number: H01L23/5226 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/5329 ,  H01L2224/10135 ,  H01L2924/07811 ,  H01L2924/00

Abstract: A component 10 can include a substrate 20 having a front surface 22 and a rear surface 21 remote therefrom, an opening 30 extending from the rear surface towards the front surface, and a conductive via 40 extending within the opening. The substrate 20 can have a CTE less than 10 ppm/°C. The opening 30 can define an inner surface 31 between the front and rear surfaces 22, 21. The conductive via 40 can include a first metal layer 41 overlying the inner surface 31 and a second metal region 42 overlying the first metal layer and electrically coupled to the first metal layer. The second metal region 42 can have a CTE greater than a CTE of the first metal layer 41. The conductive via 40 can have an effective CTE across a diameter D of the conductive via that is less than 80% of the CTE of the second metal region 42.

Abstract translation: 部件10可以包括具有远离其的前表面22和后表面21的基板20，从后表面向前表面延伸的开口30以及在开口内延伸的导电通孔40。 衬底20可具有小于10ppm /℃的CTE。 开口30可以在前表面22和后表面21之间限定内表面31.导电通孔40可以包括覆盖内表面31的第一金属层41和覆盖第一金属层的第二金属区域42， 第一金属层。 第二金属区域42可以具有大于第一金属层41的CTE的CTE。导电通孔40可以在导电通孔的直径D上具有小于第二金属的CTE的80％的有效CTE 区域42。

公开(公告)号：WO2013009741A9

公开(公告)日：2013-03-07

申请号：PCT/US2012046049

申请日：2012-07-10

Applicant: TESSERA INC ,  CRISP RICHARD DEWITT ,  HABA BELGACEM ,  ZOHNI WAEL

Inventor： CRISP RICHARD DEWITT ,  HABA BELGACEM ,  ZOHNI WAEL

IPC: H01L25/065 ,  G11C5/06

CPC classification number: H01L23/48 ,  G11C5/06 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package (10) may have a plurality of terminals (36) disposed at a face (32) thereof which are configured for connection to at least one external component, e.g., a circuit panel (70). First and second microelectronic elements (12), (14) can be affixed with packaging structure (30) therein. A first electrical connection (51A, 40A, 74A) can extend from a respective terminal (36A) of the package (10) to a corresponding contact (20A) on the first microelectronic element (12), and a second electrical connection (53A, 40B, 52A) can extend from the respective terminal (36A) to a corresponding contact (26A) on the second microelectronic element (14), the first and second connections being configured such that a respective signal carried by the first and second connections is subject to propagation delay of the same duration between the respective terminal (36A) and each of the corresponding contacts (20A, 26A) coupled thereto.

Abstract translation: 微电子封装（10）可以具有设置在其面（32）处的多个端子（36），其被配置为连接到至少一个外部部件，例如电路板（70）。 第一和第二微电子元件（12），（14）可以在其中固定有包装结构（30）。 第一电连接（51A，40A，74A）可以从封装（10）的相应端子（36A）延伸到第一微电子元件（12）上的对应触点（20A），并且第二电连接（53A， 40B，52A）可以从相应的端子（36A）延伸到第二微电子元件（14）上的相应的触点（26A），第一和第二连接被配置为使得由第一和第二连接承载的相应信号是对象 在相应的端子（36A）和与其耦合的相应的触点（20A，26A）中的每一个之间具有相同持续时间的传播延迟。

公开(公告)号：WO2013019541A2

公开(公告)日：2013-02-07

申请号：PCT/US2012/048288

申请日：2012-07-26

Applicant: TESSERA, INC. ,  MOHAMMED, Ilyas ,  HABA, Belgacem ,  UZOH, Cyprian

Inventor： MOHAMMED, Ilyas ,  HABA, Belgacem ,  UZOH, Cyprian

IPC: H01L21/768 ,  H01L23/48

CPC classification number: H01L23/5226 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/5329 ,  H01L2224/10135 ,  H01L2924/07811 ,  H01L2924/00

Abstract: A component 10 can include a substrate 20 having a front surface 22 and a rear surface 21 remote therefrom, an opening 30 extending from the rear surface towards the front surface, and a conductive via 40 extending within the opening. The substrate 20 can have a CTE less than 10 ppm/°C. The opening 30 can define an inner surface 31 between the front and rear surfaces 22, 21. The conductive via 40 can include a first metal layer 41 overlying the inner surface 31 and a second metal region 42 overlying the first metal layer and electrically coupled to the first metal layer. The second metal region 42 can have a CTE greater than a CTE of the first metal layer 41. The conductive via 40 can have an effective CTE across a diameter D of the conductive via that is less than 80% of the CTE of the second metal region 42.

Abstract translation: 组件10可以包括具有远离其的前表面22和后表面21的基板20，从后表面向前表面延伸的开口30以及在所述基板20内延伸的导电通路40。 开幕。 衬底20可以具有小于10ppm /℃的CTE。 开口30可以在前表面22和后表面21之间限定内表面31.导电通孔40可以包括覆盖内表面31的第一金属层41和覆盖第一金属层的第二金属区域42， 第一金属层。 第二金属区域42可以具有大于第一金属层41的CTE的CTE。导电通孔40可以在导电通孔的直径D上具有小于第二金属的CTE的80％的有效CTE 区域42。

公开(公告)号：WO2012145477A1

公开(公告)日：2012-10-26

申请号：PCT/US2012/034196

申请日：2012-04-19

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  ZOHNI, Wael ,  CRISP, Richard, Dewitt ,  MOHAMMED, Ilyas

Inventor： HABA, Belgacem ,  ZOHNI, Wael ,  CRISP, Richard, Dewitt ,  MOHAMMED, Ilyas

IPC: H01L25/065 ,  H01L23/31 ,  H01L25/10 ,  H01L21/98

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/18 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A microelectronic assembly 100 can include a substrate 102 having first and second surfaces 104, 106 and first and second openings 116, 126 extending between the first and second surfaces, the first and second openings each having a long dimension extending in respective first and second transverse directions. The microelectronic assembly 100 can also have first and second microelectronic elements 136, 153 each having bond pads 142, 159 in a central region 924, 932 of a front surface 140, 157 thereof aligned with the respective first and second openings 116, 126. The front surface 140 of the first microelectronic element 136 can confront the first surface 104, and the front surface 157 of the second microelectronic element 153 can face a rear surface 138 of the first microelectronic element and can project beyond an edge 146 of the first microelectronic element. The bond pads 142, 159 of the first and second microelectronic elements 136, 153 can be electrically connected to conductive elements 109, 111 of the substrate 102.

Abstract translation: 微电子组件100可以包括具有第一和第二表面104,106的衬底102以及在第一和第二表面之间延伸的第一和第二开口116,126，第一和第二开口各自具有在相应的第一和第二横向 方向。 微电子组件100还可以具有第一和第二微电子元件136,133，每个微电子元件在其相应的第一和第二开口116,126的前表面140,157的中心区域924,932中具有接合焊盘142,159。 第一微电子元件136的前表面140可以面对第一表面104，并且第二微电子元件153的前表面157可以面对第一微电子元件的后表面138并且可以突出超过第一微电子元件的边缘146 。 第一和第二微电子元件136,153的接合焊盘142,159可以电连接到衬底102的导电元件109,111。

公开(公告)号：WO2012145115A1

公开(公告)日：2012-10-26

申请号：PCT/US2012/029876

申请日：2012-03-21

Applicant: TESSERA, INC. ,  ZOHNI, Wael ,  HABA, Belgacem

Inventor： ZOHNI, Wael ,  HABA, Belgacem

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/495

CPC classification number: H01L23/49575 ,  G11C5/04 ,  G11C5/06 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/014

Abstract: A module 10 can include a module card 40 and first and second microelectronic elements 20, 30 having front surfaces 21, 31 facing a first surface 41 of the module card. The module card 40 can also have a second surface 42 and a plurality of parallel exposed edge contacts 50 adjacent an edge 43 of at least one of the first and second surfaces 41, 42 for mating with corresponding contacts 1207 of a socket 1205 when the module 10 is inserted in the socket. Each microelectronic element 20, 30 can be electrically connected to the module card 40. The front surface 31 of the second microelectronic element 30 can partially overlie a rear surface 22 of the first microelectronic element 20 and can be attached thereto.

Abstract translation: 模块10可以包括模块卡40和具有面向模块卡的第一表面41的前表面21,31的第一和第二微电子元件20,30。 模块卡40还可具有邻近第一和第二表面41,42中的至少一个的边缘43的第二表面42和多个平行的暴露的边缘触点50，用于与插座1205的对应接触件1207配合，当模块 10插入插座。 每个微电子元件20,30可以电连接到模块卡40.第二微电子元件30的前表面31可以部分地覆盖第一微电子元件20的后表面22并且可以附接到其上。

公开(公告)号：WO2012145114A1

公开(公告)日：2012-10-26

申请号：PCT/US2012/029873

申请日：2012-03-21

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  CRISP, Richard, Dewitt ,  ZOHNI, Wael

Inventor： HABA, Belgacem ,  CRISP, Richard, Dewitt ,  ZOHNI, Wael

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/38

CPC classification number: H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

Abstract: A microelectronic assembly 10 can include a substrate 30 having an aperture 39 extending between first and second surfaces 34, 32 thereof, substrate contacts 41 at the first surface, and terminals 36 at the second surface. The microelectronic assembly 10 can include a first microelectronic element 12 having a front surface 16 facing the first surface 34, a second microelectronic element 14 having a front surface 22 facing the first microelectronic element, and leads 50 electrically connecting contacts 26 of the second microelectronic element with the terminals 36. The contacts 26 of the second microelectronic element 14 can be exposed at the front surface 22 beyond an edge 29 of the first microelectronic element 12. The first microelectronic element 12 can be configured to regenerate at least some signals received by the microelectronic assembly 10 at the terminals 36 and to transmit said signals to the second microelectronic element 14.

Abstract translation: 微电子组件10可以包括具有在其第一和第二表面34,32之间延伸的孔39，在第一表面处的衬底触点41和在第二表面处的端子36的衬底30。 微电子组件10可以包括具有面向第一表面34的前表面16的第一微电子元件12，具有面向第一微电子元件的前表面22的第二微电子元件14，以及电连接第二微电子元件的触点26的引线50 第二微电子元件14的触头26可以在前表面22处暴露在第一微电子元件12的边缘29之外。第一微电子元件12可以被配置为再生至少一些由 微电子组件10，并将所述信号传送到第二微电子元件14。

公开(公告)号：WO2012061199A3

公开(公告)日：2012-06-28

申请号：PCT/US2011058080

申请日：2011-10-27

Applicant: TESSERA INC ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  CHAU ELLIS ,  LEE SANG II ,  DESAI KISHOR

Inventor： HABA BELGACEM ,  MOHAMMED ILYAS ,  CHAU ELLIS ,  LEE SANG II ,  DESAI KISHOR

IPC: H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1601 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for making a microelectronic assembly includes providing a microelectronic element 30 with first conductive elements and a dielectric element 50 with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts 40 and other of the first or second conductive elements may include a bond metal 10 disposed between some of the conductive posts 40. An underfill layer 60 may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer 60 and at least deform the bond metal 10. The microelectronic element 30 and the dielectric element 50 can be heated to join them together. The height of the posts 40 above the surface may be at least forty percent of a distance between surfaces of the microelectronic element 30 and dielectric element 50.

Abstract translation: 制造微电子组件的方法包括：将微电子元件30提供有第一导电元件和具有第二导电元件的电介质元件50。 第一导电元件或第二导电元件中的至少一些可以是导电柱40，并且第一或第二导电元件中的另一个可以包括设置在一些导电柱40之间的接合金属10.底部填充层60可能过度一些 的第一或第二导电元件。 第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得支柱刺穿底部填充层60并且至少使接合金属10变形。微电子元件30和电介质元件50可被加热到 一起加入 表面上方的柱40的高度可以是微电子元件30和电介质元件50的表面之间的距离的至少40％。

公开(公告)号：WO2012082168A1

公开(公告)日：2012-06-21

申请号：PCT/US2011/024143

申请日：2011-02-09

Applicant: TESSERA INC. ,  HABA, Belgacem ,  MOHAMMED, Ilyas

Inventor： HABA, Belgacem ,  MOHAMMED, Ilyas

IPC: H01L21/98 ,  H01L25/10 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/811 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package (10) includes a substrate (20) having a first region (26), a second region (28), a first surface (22), and a second surface (24) remote from the first surface (22). At least one microelectronic element (60) overlies the first region (26) on the first surface (229. First electrically conductive elements (30) are exposed at one of the first surface (22) and the second surface (24) of the substrate (20) within the second (28) region with at least some of the first conductive elements (30) electrically connected to the at least one microelectronic element (60). Substantially rigid metal elements (40) overlie the first conductive elements (30) and have end surfaces (42) remote therefrom. A bond metal (41) joins the metal elements (40) with the first conductive elements (30), and a molded dielectric layer (50) overlies at least the second region (28) of the substrate (20) and has a surface (52) remote from the substrate (20). The end surfaces (42) of the metal elements (40) are at least partially exposed at the surface (52) of the molded dielectric layer (50).

Abstract translation: 微电子封装（10）包括具有第一区域（26），第二区域（28），第一表面（22）和远离第一表面（22）的第二表面（24）的衬底（20）。 至少一个微电子元件（60）覆盖在第一表面（229）上的第一区域（26）上。第一导电元件（30）暴露在基板的第一表面（22）和第二表面（24）之一处 （20）中的至少一些第一导电元件（30）电连接到所述至少一个微电子元件（60）上，基本上刚性的金属元件（40）覆盖在所述第一导电元件（30）上， 并且具有远离其的端面（42），接合金属（41）将金属元件（40）与第一导电元件（30）接合，并且模制的电介质层（50）至少覆盖第二区域 所述衬底（20）具有远离所述衬底（20）的表面（52），所述金属元件（40）的端表面（42）至少部分地暴露在所述模制的电介质层的表面（52） 50）。

公开(公告)号：WO2012075371A1

公开(公告)日：2012-06-07

申请号：PCT/US2011/063025

申请日：2011-12-02

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  OGANESIAN, Vage ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  MITCHELL, Craig

Inventor： HABA, Belgacem ,  OGANESIAN, Vage ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  MITCHELL, Craig

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/16

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/15311

Abstract: A microelectronic assembly (100) can include first and second microelectronic elements (102, 112) each embodying active semiconductor devices adjacent a front surface (104, 114) thereof, and an interposer (120) of a material having a CTE less than 10 ppm/°C. Each microelectronic element (102, 112) can have a conductive pad (106, 116) exposed at the respective front surface (104, 114). The interposer (120) can have a second conductive element (118) extending within an opening (222) in the interposer and exposed at first and second surfaces (227, 229) of the interposer. The first and second surfaces (227, 229) can face the front surface (104, 114) of the respective first and second microelectronic elements (102, 112). Each microelectronic element (102, 112) can include a first conductive element (236, 238) extending within an opening (206, 216) extending from a rear surface (237, 239) towards the front surface (104, 114) of the respective microelectronic element. At least one of the first conductive elements (236, 238) can extend through the conductive pad (204, 214) of the respective first or second microelectronic element (102, 112).

Abstract translation: 微电子组件（100）可以包括第一和第二微电子元件（102,112），每个微电子元件（102,112）各自体现邻近其前表面（104,114）的有源半导体器件，以及具有CTE小于10ppm的材料的插入件（120） /C。 每个微电子元件（102,112）可以具有在相应的前表面（104,114）处暴露的导电垫（106,116）。 插入器（120）可以具有在插入器中的开口（222）内延伸并在插入件的第一和第二表面（227,229）处露出的第二导电元件（118）。 第一和第二表面（227,229）可面对相应的第一和第二微电子元件（102,112）的前表面（104,114）。 每个微电子元件（102,112）可以包括第一导电元件（236,238），该第一导电元件（236,238）在从后表面（237,239）朝向相应的后表面（227,119）的前表面（104,114）延伸的开口（206,216）内延伸 微电子元件。 第一导电元件（236,238）中的至少一个可以延伸通过相应的第一或第二微电子元件（102,112）的导电焊盘（204,214）。