Invention Application
WO2009117476A2 METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE OR CIRCUIT ASSEMBLY USING A FLUXING UNDERFILL COMPOSITION APPLIED TO SOLDER CONTACT POINTS IN A DIP PROCESS
审中-公开
使用适用于DIP工艺中的焊接接触点的焊接成分组合的半导体封装或电路组件的制造方法
- Patent Title: METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE OR CIRCUIT ASSEMBLY USING A FLUXING UNDERFILL COMPOSITION APPLIED TO SOLDER CONTACT POINTS IN A DIP PROCESS
- Patent Title (中): 使用适用于DIP工艺中的焊接接触点的焊接成分组合的半导体封装或电路组件的制造方法
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Application No.: PCT/US2009/037491Application Date: 2009-03-18
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Publication No.: WO2009117476A2Publication Date: 2009-09-24
- Inventor: CHAN, Chew, B. , JI, Qing , CURRIE, Mark , POOLE, Neil , KELLY, Geraldine
- Applicant: HENKEL CORPORATION , CHAN, Chew, B. , JI, Qing , CURRIE, Mark , POOLE, Neil , KELLY, Geraldine
- Applicant Address: 1001 Trout Brook Crossing Rocky Hill, CT 06067 US
- Assignee: HENKEL CORPORATION,CHAN, Chew, B.,JI, Qing,CURRIE, Mark,POOLE, Neil,KELLY, Geraldine
- Current Assignee: HENKEL CORPORATION,CHAN, Chew, B.,JI, Qing,CURRIE, Mark,POOLE, Neil,KELLY, Geraldine
- Current Assignee Address: 1001 Trout Brook Crossing Rocky Hill, CT 06067 US
- Agency: CUNNINGHAM, Marina, F. et al.
- Priority: US61/037,753 20080319
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/60 ; H01L23/02
Abstract:
The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.
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