Invention Application
WO2009129332A2 ATOMIC LAYER DEPOSITION OF METAL CARBIDE FILMS USING ALUMINUM HYDROCARBON COMPOUNDS
审中-公开
使用铝氢化合物的金属碳膜的原子层沉积
- Patent Title: ATOMIC LAYER DEPOSITION OF METAL CARBIDE FILMS USING ALUMINUM HYDROCARBON COMPOUNDS
- Patent Title (中): 使用铝氢化合物的金属碳膜的原子层沉积
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Application No.: PCT/US2009/040705Application Date: 2009-04-15
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Publication No.: WO2009129332A2Publication Date: 2009-10-22
- Inventor: LI, Dong , MARCUS, Steven , HAUKKA, Suvi, P. , LI, Wei-Min
- Applicant: ASM AMERICA, INC.
- Applicant Address: 3440 E. University Drive Phoenix, AZ 85034-7200 US
- Assignee: ASM AMERICA, INC.
- Current Assignee: ASM AMERICA, INC.
- Current Assignee Address: 3440 E. University Drive Phoenix, AZ 85034-7200 US
- Agency: KIMMEL, Andrew, I.
- Priority: US61/045,554 20080416
- Main IPC: H01L21/205
- IPC: H01L21/205 ; H01L21/336 ; H01L21/28 ; H01L21/3205
Abstract:
Methods of forming metal carbide films are provided. In some embodiments, a substrate is exposed to alternating pulses of a transition metal species and an aluminum hydrocarbon compound, such as TMA, DMAH, or TEA. The aluminum hydrocarbon compound is selected to achieve the desired properties of the metal carbide film, such as aluminum concentration, resistivity, adhesion and oxidation resistance. In some embodiments, the methods are used to form a metal carbide layer that determines the work function of a control gate in a flash memory.
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