Invention Application
- Patent Title: DEBOND INTERCONNECT STRUCTURES
- Patent Title (中): DEBOND互连结构
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Application No.: PCT/US2011030808Application Date: 2011-03-31
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Publication No.: WO2011126925A2Publication Date: 2011-10-13
- Inventor: MA QING , HE JUN , MORROW PATRICK , FISCHER PAUL B , BALAKRISHNAN SRIDHAR , RADHAKRISHNAN SATISH , ANDRYUSHCHENKO TATYANA TANYA , XU GUANGHAI
- Applicant: INTEL CORP , MA QING , HE JUN , MORROW PATRICK , FISCHER PAUL B , BALAKRISHNAN SRIDHAR , RADHAKRISHNAN SATISH , ANDRYUSHCHENKO TATYANA TANYA , XU GUANGHAI
- Assignee: INTEL CORP,MA QING,HE JUN,MORROW PATRICK,FISCHER PAUL B,BALAKRISHNAN SRIDHAR,RADHAKRISHNAN SATISH,ANDRYUSHCHENKO TATYANA TANYA,XU GUANGHAI
- Current Assignee: INTEL CORP,MA QING,HE JUN,MORROW PATRICK,FISCHER PAUL B,BALAKRISHNAN SRIDHAR,RADHAKRISHNAN SATISH,ANDRYUSHCHENKO TATYANA TANYA,XU GUANGHAI
- Priority: US75674810 2010-04-08
- Main IPC: H05K3/32
- IPC: H05K3/32 ; H05K1/18
Abstract:
The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
Information query
