公开(公告)号：WO2011126925A2

公开(公告)日：2011-10-13

申请号：PCT/US2011030808

申请日：2011-03-31

Applicant: INTEL CORP ,  MA QING ,  HE JUN ,  MORROW PATRICK ,  FISCHER PAUL B ,  BALAKRISHNAN SRIDHAR ,  RADHAKRISHNAN SATISH ,  ANDRYUSHCHENKO TATYANA TANYA ,  XU GUANGHAI

Inventor： MA QING ,  HE JUN ,  MORROW PATRICK ,  FISCHER PAUL B ,  BALAKRISHNAN SRIDHAR ,  RADHAKRISHNAN SATISH ,  ANDRYUSHCHENKO TATYANA TANYA ,  XU GUANGHAI

IPC: H05K3/32 ,  H05K1/18

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract translation: 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：WO2011126925A3

公开(公告)日：2011-10-13

申请号：PCT/US2011/030808

申请日：2011-03-31

Applicant: INTEL CORPORATION ,  MA, Qing ,  HE, Jun ,  MORROW, Patrick ,  FISCHER, Paul B. ,  BALAKRISHNAN, Sridhar ,  RADHAKRISHNAN, Satish ,  ANDRYUSHCHENKO, Tatyana Tanya ,  XU, Guanghai

Inventor： MA, Qing ,  HE, Jun ,  MORROW, Patrick ,  FISCHER, Paul B. ,  BALAKRISHNAN, Sridhar ,  RADHAKRISHNAN, Satish ,  ANDRYUSHCHENKO, Tatyana Tanya ,  XU, Guanghai

IPC: H05K3/32 ,  H05K1/18

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.