发明申请
WO2011156221A3 WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
审中-公开
具有脉冲UV光源的WAFER背面涂层工艺
- 专利标题： WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
- 专利标题（中）： 具有脉冲UV光源的WAFER背面涂层工艺
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申请号： PCT/US2011039044申请日： 2011-06-03
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公开(公告)号： WO2011156221A3公开(公告)日： 2012-04-05
- 发明人: GASA JEFFREY , PHAN DUNG NGHI , LEON JEFFREY , HAJELA SHARAD , KONG SHENGQIAN
- 申请人： HENKEL CORP , GASA JEFFREY , PHAN DUNG NGHI , LEON JEFFREY , HAJELA SHARAD , KONG SHENGQIAN
- 专利权人： HENKEL CORP,GASA JEFFREY,PHAN DUNG NGHI,LEON JEFFREY,HAJELA SHARAD,KONG SHENGQIAN
- 当前专利权人： HENKEL CORP,GASA JEFFREY,PHAN DUNG NGHI,LEON JEFFREY,HAJELA SHARAD,KONG SHENGQIAN
- 优先权： US35258410 2010-06-08
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.
IPC分类:
