公开(公告)号：WO2013006447A2

公开(公告)日：2013-01-10

申请号：PCT/US2012044968

申请日：2012-06-29

Applicant: HENKEL CORP ,  PEDDI RAJ ,  GASA JEFFREY ,  KURIYAMA KENJI ,  YOO HOSEUNG

Inventor： PEDDI RAJ ,  GASA JEFFREY ,  KURIYAMA KENJI ,  YOO HOSEUNG

CPC classification number: H01L21/78 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/27009 ,  H01L2224/27416 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.

Abstract translation: 一种半导体晶片的半导体晶片的制造方法，其特征在于，在所述晶片的上侧具有由切割线分隔开的多个制造区域和所述晶片的背面侧的粘合剂涂层的半导体晶片的制造方法， 不打印打印粘合剂涂层的切割线; 将粘合剂涂层施加到晶片的背面; 去除驱虫剂材料; 以及将所述晶片沿切割线分离成单独的模具。

公开(公告)号：WO2011156225A2

公开(公告)日：2011-12-15

申请号：PCT/US2011/039061

申请日：2011-06-03

Applicant: HENKEL CORPORATION ,  HAJELA, Sharad ,  KONG, Shengqian ,  GASA, Jeffrey ,  LEON, Jeffrey ,  PHAN, Dung, Nghi

Inventor： HAJELA, Sharad ,  KONG, Shengqian ,  GASA, Jeffrey ,  LEON, Jeffrey ,  PHAN, Dung, Nghi

IPC: C09J163/00 ,  C09J133/04 ,  C09J11/00

CPC classification number: C09D163/04 ,  C08G77/28 ,  C08L33/08 ,  C08L63/00 ,  C08L83/04 ,  C09J133/062 ,  C09J163/00 ,  Y10T428/31511

Abstract: A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.

Abstract translation: 晶片背面涂料组合物包含环氧树脂，具有烯属不饱和键的树脂和反应性硫化合物，并且有效地减少回流操作期间的分层。

公开(公告)号：WO2011156225A3

公开(公告)日：2012-04-19

申请号：PCT/US2011039061

申请日：2011-06-03

Applicant: HENKEL CORP ,  HAJELA SHARAD ,  KONG SHENGQIAN ,  GASA JEFFREY ,  LEON JEFFREY ,  PHAN DUNG NGHI

Inventor： HAJELA SHARAD ,  KONG SHENGQIAN ,  GASA JEFFREY ,  LEON JEFFREY ,  PHAN DUNG NGHI

IPC: C09J163/00 ,  C09J11/00 ,  C09J133/04

CPC classification number: C09D163/04 ,  C08G77/28 ,  C08L33/08 ,  C08L63/00 ,  C08L83/04 ,  C09J133/062 ,  C09J163/00 ,  Y10T428/31511

Abstract: A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.

Abstract translation: 晶片背面涂料组合物包含环氧树脂，具有烯属不饱和键的树脂和反应性硫化合物，并且有效地减少回流操作期间的分层。

公开(公告)号：WO2011156221A3

公开(公告)日：2012-04-05

申请号：PCT/US2011039044

申请日：2011-06-03

Applicant: HENKEL CORP ,  GASA JEFFREY ,  PHAN DUNG NGHI ,  LEON JEFFREY ,  HAJELA SHARAD ,  KONG SHENGQIAN

Inventor： GASA JEFFREY ,  PHAN DUNG NGHI ,  LEON JEFFREY ,  HAJELA SHARAD ,  KONG SHENGQIAN

IPC: H01L23/12

CPC classification number: C08L63/00 ,  C08G77/28 ,  C08L83/08 ,  H01L21/56 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/296 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2937 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.

Abstract translation: 用涂料组合物涂覆半导体晶片的方法包括用脉冲UV光固化涂层，从而防止回流操作期间的分层。 在一个具体实施方案中，涂料组合物包含环氧树脂和丙烯酸酯树脂。 环氧树脂可以热固化; 丙烯酸酯树脂通过UV照射固化。

公开(公告)号：WO2007101051A2

公开(公告)日：2007-09-07

申请号：PCT/US2007/062553

申请日：2007-02-22

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA ,  WUDL, Fred ,  STUCKY, Galen ,  TASAKI, Ken ,  WANG, Hengbin ,  GASA, Jeffrey, V. ,  DESOUSA, Ryan, Francis

Inventor： WUDL, Fred ,  STUCKY, Galen ,  TASAKI, Ken ,  WANG, Hengbin ,  GASA, Jeffrey, V. ,  DESOUSA, Ryan, Francis

CPC classification number: H01M8/1011 ,  H01M8/1023 ,  H01M8/1025 ,  H01M8/1027 ,  H01M8/103 ,  H01M8/1032 ,  H01M8/1034 ,  H01M8/1039 ,  H01M8/1048 ,  Y02E60/523

Abstract: For use in a DMFC, a proton-conducting membrane containing a proton- conducting host polymer and a functionalized fullerene having one or more proton accepting or proton donating functional groups selected from: >C[PO(OH) 2 ] 2 ; - PO(OH) 2 J-OH; -SO 3 H; -NH 2 ; -CN; -HOSO 3 H; -COOH; -OPO(OH) 2 ; and -OSO 3 or a combination of two or more of these groups attached to the fullerene.

Abstract translation: 为了在DMFC中使用，含有质子传导性主体聚合物和具有一个或多个质子接受或质子供体官能团的官能化富勒烯的质子传导膜选自：> C [PO（OH）2 ] _{2 ; - PO（OH）2 J-OH; -SO 3 H; -NH 2 ; -CN; -HOSO 3 H; -COOH; -OPO（OH） 2 ; 和-OSO 3 3或者连接在富勒烯上的这些基团中的两个或更多个的组合。}

公开(公告)号：WO2014190151A1

公开(公告)日：2014-11-27

申请号：PCT/US2014/039138

申请日：2014-05-22

Applicant: HENKEL IP & HOLDING GMBH ,  GASA, Jeffrey ,  TRAN, Steve

Inventor： GASA, Jeffrey ,  TRAN, Steve

IPC: B32B27/00

CPC classification number: C09J123/22 ,  B32B27/08 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B37/06 ,  B32B37/12 ,  B32B37/14 ,  B32B2250/24 ,  B32B2250/242 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/29 ,  C09J7/30 ,  C09J2423/00 ,  C09J2427/001 ,  H01L51/5246

Abstract: A multi-layer barrier adhesive is used for the encapsulation of electronic devices, such as organic light-emitting diodes (OLEDs), photovoltaics, and thin-film transistors. The multi-layer adhesive comprises at least one barrier layer disposed adjacent at least one adhesive layer. In one embodiment the barrier layer is a fluoropolymer. The fluoropolymer is preferably a homopolymer of tetrafluoroethylene (PTFE) or chlorotrifluoroethylene (PCTFE), or their copolymers.

Abstract translation: 多层屏障粘合剂用于电子器件的封装，例如有机发光二极管（OLED），光伏和薄膜晶体管。 多层粘合剂包括邻近至少一个粘合剂层设置的至少一个阻挡层。 在一个实施方案中，阻挡层是含氟聚合物。 含氟聚合物优选为四氟乙烯（PTFE）或氯三氟乙烯（PCTFE）的均聚物或它们的共聚物。

公开(公告)号：WO2007101051A3

公开(公告)日：2008-05-02

申请号：PCT/US2007062553

申请日：2007-02-22

Applicant: UNIV CALIFORNIA ,  WUDL FRED ,  STUCKY GALEN ,  TASAKI KEN ,  WANG HENGBIN ,  GASA JEFFREY V ,  DESOUSA RYAN FRANCIS

Inventor： WUDL FRED ,  STUCKY GALEN ,  TASAKI KEN ,  WANG HENGBIN ,  GASA JEFFREY V ,  DESOUSA RYAN FRANCIS

IPC: H01M8/10

CPC classification number: H01M8/1011 ,  H01M8/1023 ,  H01M8/1025 ,  H01M8/1027 ,  H01M8/103 ,  H01M8/1032 ,  H01M8/1034 ,  H01M8/1039 ,  H01M8/1048 ,  Y02E60/523

Abstract: For use in a DMFC, a proton-conducting membrane containing a proton- conducting host polymer and a functionalized fullerene having one or more proton accepting or proton donating functional groups selected from: >C[PO(OH) 2 ] 2 ; - PO(OH) 2 J-OH; -SO 3 H; -NH 2 ; -CN; -HOSO 3 H; -COOH; -OPO(OH) 2 ; and -OSO 3 or a combination of two or more of these groups attached to the fullerene.

Abstract translation: 为了在DMFC中使用，含有质子传导性主体聚合物和具有一个或多个质子接受或质子供体官能团的官能化富勒烯的质子传导膜选自：> C [PO（OH）2 ] _{2 ; - PO（OH）2 J-OH; -SO 3 H; -NH 2 ; -CN; -HOSO 3 H; -COOH; -OPO（OH） 2 ; 和-OSO 3 3或者连接在富勒烯上的这些基团中的两个或更多个的组合。}

公开(公告)号：WO2007101057A3

公开(公告)日：2008-04-10

申请号：PCT/US2007062563

申请日：2007-02-22

Applicant: UNIV CALIFORNIA ,  WUDL FRED ,  STUCKY GALEN ,  TASAKI KEN ,  WANG HENGBIN ,  GASA JEFFREY V ,  DESOUSA RYAN FRANCIS

Inventor： WUDL FRED ,  STUCKY GALEN ,  TASAKI KEN ,  WANG HENGBIN ,  GASA JEFFREY V ,  DESOUSA RYAN FRANCIS

IPC: H01M8/10 ,  H01M10/0525 ,  H01M10/0565 ,  H01M10/36

CPC classification number: H01M10/056 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/15 ,  C01B32/152 ,  H01M10/0525 ,  H01M10/0565 ,  H01M2300/0065 ,  H01M2300/0082 ,  Y02T10/7011

Abstract: Pegylated fullerenes, for use with a lithium ion battery as a solvent-free electrolyte, having the formula {[CH 3 -(PEO)] m -LINKER} n -fullerene, with n = 1, m = 1 to 5, and the LINKER group comprising a moiety capable of attaching each of the CH 3 -(PEO)- chains to the fullerene.

Abstract translation: 聚乙二醇化的富勒烯，用于锂离子电池作为无溶剂电解质，具有下式{[CH 3 - （PEO）] m - -LINKER} n = 1，m = 1至5，并且包含能够将每个CH 3 - （PEO） - 链连接到富勒烯的部分的LINKER基团 。

公开(公告)号：WO2007101057A2

公开(公告)日：2007-09-07

申请号：PCT/US2007/062563

申请日：2007-02-22

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA ,  WUDL, Fred ,  STUCKY, Galen ,  TASAKI, Ken ,  WANG, Hengbin ,  GASA, Jeffrey, V. ,  DESOUSA, Ryan, Francis

Inventor： WUDL, Fred ,  STUCKY, Galen ,  TASAKI, Ken ,  WANG, Hengbin ,  GASA, Jeffrey, V. ,  DESOUSA, Ryan, Francis

IPC: H01M10/0525 ,  H01M10/0565 ,  H01M10/36

CPC classification number: H01M10/056 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/15 ,  C01B32/152 ,  H01M10/0525 ,  H01M10/0565 ,  H01M2300/0065 ,  H01M2300/0082 ,  Y02T10/7011

Abstract: Pegylated fullerenes, for use with a lithium ion battery as a solvent-free electrolyte, having the formula {[CH 3 -(PEO)] m -LINKER} n -fullerene, with n ≥ 1, m ≥ 1 to 5, and the LINKER group comprising a moiety capable of attaching each of the CH 3 -(PEO)- chains to the fullerene.

Abstract translation: 聚乙二醇化的富勒烯，用于锂离子电池作为无溶剂电解质，具有式{[CH 3 - （PEO）] m - -LINKER} n = 1，m = 1至5，并且包含能够将每个CH 3 - （PEO） - 链连接到富勒烯的部分的LINKER基团 。

公开(公告)号：WO2013006447A3

公开(公告)日：2013-01-10

申请号：PCT/US2012/044968

申请日：2012-06-29

Applicant: HENKEL CORPORATION ,  PEDDI, Raj ,  GASA, Jeffrey ,  KURIYAMA, Kenji ,  YOO, Hoseung

Inventor： PEDDI, Raj ,  GASA, Jeffrey ,  KURIYAMA, Kenji ,  YOO, Hoseung

IPC: H01L21/78 ,  H01L21/301

Abstract: A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.