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1.发明申请
公开(公告)号：WO2011156225A2
公开(公告)日：2011-12-15
申请号：PCT/US2011/039061
申请日：2011-06-03
Applicant: HENKEL CORPORATION , HAJELA, Sharad , KONG, Shengqian , GASA, Jeffrey , LEON, Jeffrey , PHAN, Dung, Nghi
Inventor： HAJELA, Sharad , KONG, Shengqian , GASA, Jeffrey , LEON, Jeffrey , PHAN, Dung, Nghi
IPC: C09J163/00 , C09J133/04 , C09J11/00
CPC classification number: C09D163/04 , C08G77/28 , C08L33/08 , C08L63/00 , C08L83/04 , C09J133/062 , C09J163/00 , Y10T428/31511
Abstract: A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.
Abstract translation: 晶片背面涂料组合物包含环氧树脂，具有烯属不饱和键的树脂和反应性硫化合物，并且有效地减少回流操作期间的分层。
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2.发明申请
公开(公告)号：WO2011156225A3
公开(公告)日：2012-04-19
申请号：PCT/US2011039061
申请日：2011-06-03
Applicant: HENKEL CORP , HAJELA SHARAD , KONG SHENGQIAN , GASA JEFFREY , LEON JEFFREY , PHAN DUNG NGHI
Inventor： HAJELA SHARAD , KONG SHENGQIAN , GASA JEFFREY , LEON JEFFREY , PHAN DUNG NGHI
IPC: C09J163/00 , C09J11/00 , C09J133/04
CPC classification number: C09D163/04 , C08G77/28 , C08L33/08 , C08L63/00 , C08L83/04 , C09J133/062 , C09J163/00 , Y10T428/31511
Abstract: A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.
Abstract translation: 晶片背面涂料组合物包含环氧树脂，具有烯属不饱和键的树脂和反应性硫化合物，并且有效地减少回流操作期间的分层。
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公开(公告)号：WO2011156221A3
公开(公告)日：2012-04-05
申请号：PCT/US2011039044
申请日：2011-06-03
Applicant: HENKEL CORP , GASA JEFFREY , PHAN DUNG NGHI , LEON JEFFREY , HAJELA SHARAD , KONG SHENGQIAN
Inventor： GASA JEFFREY , PHAN DUNG NGHI , LEON JEFFREY , HAJELA SHARAD , KONG SHENGQIAN
IPC: H01L23/12
CPC classification number: C08L63/00 , C08G77/28 , C08L83/08 , H01L21/56 , H01L21/6836 , H01L23/293 , H01L23/296 , H01L24/27 , H01L24/29 , H01L24/83 , H01L25/50 , H01L2224/274 , H01L2224/27436 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/2937 , H01L2224/29386 , H01L2224/29388 , H01L2224/29393 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01061 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0635 , H01L2924/00 , H01L2924/00014 , H01L2924/05432 , H01L2924/05442 , H01L2924/04642 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.
Abstract translation: 用涂料组合物涂覆半导体晶片的方法包括用脉冲UV光固化涂层，从而防止回流操作期间的分层。 在一个具体实施方案中，涂料组合物包含环氧树脂和丙烯酸酯树脂。 环氧树脂可以热固化; 丙烯酸酯树脂通过UV照射固化。
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公开(公告)号：WO2011156221A2
公开(公告)日：2011-12-15
申请号：PCT/US2011/039044
申请日：2011-06-03
Applicant: HENKEL CORPORATION , GASA, Jeffrey , PHAN, Dung, Nghi , LEON, Jeffrey , HAJELA, Sharad , KONG, Shengqian
Inventor： GASA, Jeffrey , PHAN, Dung, Nghi , LEON, Jeffrey , HAJELA, Sharad , KONG, Shengqian
IPC: H01L23/12
CPC classification number: C08L63/00 , C08G77/28 , C08L83/08 , H01L21/56 , H01L21/6836 , H01L23/293 , H01L23/296 , H01L24/27 , H01L24/29 , H01L24/83 , H01L25/50 , H01L2224/274 , H01L2224/27436 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/2937 , H01L2224/29386 , H01L2224/29388 , H01L2224/29393 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01061 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0635 , H01L2924/00 , H01L2924/00014 , H01L2924/05432 , H01L2924/05442 , H01L2924/04642 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.
Abstract translation: 用涂料组合物涂覆半导体晶片的方法包括用脉冲UV光固化涂层，从而防止回流操作期间的分层。 在一个具体实施方案中，涂料组合物包含环氧树脂和丙烯酸酯树脂。 环氧树脂可以热固化; 丙烯酸酯树脂通过UV照射固化。
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