Invention Application
WO2013032725A3 GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
审中-公开
玻璃作为衬底材料和MEMS和IC器件的最终包装
- Patent Title: GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
- Patent Title (中): 玻璃作为衬底材料和MEMS和IC器件的最终包装
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Application No.: PCT/US2012051183Application Date: 2012-08-16
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Publication No.: WO2013032725A3Publication Date: 2013-04-25
- Inventor: PETERSEN KURT EDWARD , SHENOY RAVINDRA V , BLACK JUSTIN PHELPS , BURNS DAVID WILLIAM , GANAPATHI SRINIVASAN KODAGANALLUR , STEPHANOU PHILIP JASON , BUCHAN NICHOLAS IAN
- Applicant: QUALCOMM MEMS TECHNOLOGIES INC , PETERSEN KURT EDWARD , SHENOY RAVINDRA V , BLACK JUSTIN PHELPS , BURNS DAVID WILLIAM , GANAPATHI SRINIVASAN KODAGANALLUR , STEPHANOU PHILIP JASON , BUCHAN NICHOLAS IAN
- Assignee: QUALCOMM MEMS TECHNOLOGIES INC,PETERSEN KURT EDWARD,SHENOY RAVINDRA V,BLACK JUSTIN PHELPS,BURNS DAVID WILLIAM,GANAPATHI SRINIVASAN KODAGANALLUR,STEPHANOU PHILIP JASON,BUCHAN NICHOLAS IAN
- Current Assignee: QUALCOMM MEMS TECHNOLOGIES INC,PETERSEN KURT EDWARD,SHENOY RAVINDRA V,BLACK JUSTIN PHELPS,BURNS DAVID WILLIAM,GANAPATHI SRINIVASAN KODAGANALLUR,STEPHANOU PHILIP JASON,BUCHAN NICHOLAS IAN
- Priority: US201113221701 2011-08-30
- Main IPC: H01L23/053
- IPC: H01L23/053 ; B81C1/00 ; H01L23/055 ; H01L23/057 ; H01L23/08 ; H01L23/10 ; H01L23/15 ; H01L25/065 ; H01L25/10 ; H01L27/146 ; H01L31/048 ; H05K3/42
Abstract:
This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
Information query
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