公开(公告)号：WO2013032725A3

公开(公告)日：2013-04-25

申请号：PCT/US2012051183

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

Inventor： PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

IPC: H01L23/053 ,  B81C1/00 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L25/065 ,  H01L25/10 ,  H01L27/146 ,  H01L31/048 ,  H05K3/42

CPC classification number: H01L23/10 ,  B81B7/007 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L23/053 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）设备的玻璃封装的系统，方法和设备。 在一个方面，玻璃封装可以包括玻璃基板，盖玻璃以及封装在玻璃基板和盖玻璃之间的一个或多个装置。 可以用诸如环氧树脂的粘合剂或金属结合环将覆盖玻璃结合到玻璃基板。 玻璃封装还可以包括一个或多个装置与封装外部之间的一个或多个信号传输路径。 在一些实施方式中，包括EMS和/或IC装置的玻璃封装被配置为通过表面安装技术直接附接到印刷电路板（PCB）或其他集成基板。

公开(公告)号：WO2013032725A2

公开(公告)日：2013-03-07

申请号：PCT/US2012/051183

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  PETERSEN, Kurt Edward ,  SHENOY, Ravindra V. ,  BLACK, Justin Phelps ,  BURNS, David William ,  GANAPATHI, Srinivasan Kodaganallur ,  STEPHANOU, Philip Jason ,  BUCHAN, Nicholas, Ian

Inventor： PETERSEN, Kurt Edward ,  SHENOY, Ravindra V. ,  BLACK, Justin Phelps ,  BURNS, David William ,  GANAPATHI, Srinivasan Kodaganallur ,  STEPHANOU, Philip Jason ,  BUCHAN, Nicholas, Ian

IPC: H01L23/053 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L25/065 ,  H01L25/10 ,  H01L27/146 ,  H01L31/048 ,  H05K3/42 ,  B81C1/00

CPC classification number: H01L23/10 ,  B81B7/007 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L23/053 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。 覆盖玻璃可以用诸如环氧树脂或金属粘结环的粘合剂结合到玻璃基板上。 玻璃包装还可以包括在一个或多个装置和包装外部之间的一个或多个信号传输路径。 在一些实施方案中，包括EMS和/或IC器件的玻璃封装被配置为通过表面贴装技术直接附接到印刷电路板（PCB）或其它集成基板。

公开(公告)号：WO2013032728A2

公开(公告)日：2013-03-07

申请号：PCT/US2012/051216

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  PETERSEN, Kurt Edward ,  SHENOY, Ravindra V. ,  BLACK, Justin Phelps ,  BURNS, David William ,  GANAPATHI, Srinivasan Kodaganallur ,  STEPHANOU, Philip Jason ,  BUCHAN, Nicholas Ian

Inventor： PETERSEN, Kurt Edward ,  SHENOY, Ravindra V. ,  BLACK, Justin Phelps ,  BURNS, David William ,  GANAPATHI, Srinivasan Kodaganallur ,  STEPHANOU, Philip Jason ,  BUCHAN, Nicholas Ian

IPC: B81B7/00

CPC classification number: B81B7/0067 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0109 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  Y10T29/5313 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖，一个或多个封装在玻璃基板和盖玻璃之间的装置，以及被配置成连接到柔性连接器并与封装装置电连通的接合垫。 在一些实施方案中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的诸如集成电路（IC）器件或PCB之类的电气元件。

公开(公告)号：WO2012054359A1

公开(公告)日：2012-04-26

申请号：PCT/US2011/056464

申请日：2011-10-14

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  GANAPATHI, Srinivasan, Kodaganallur ,  BUCHAN, Nicholas Ian ,  BURNS, David, William ,  SMITH, Thad, William ,  OPRIS, Ion, Elinor

Inventor： GANAPATHI, Srinivasan, Kodaganallur ,  BUCHAN, Nicholas Ian ,  BURNS, David, William ,  SMITH, Thad, William ,  OPRIS, Ion, Elinor

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G02B26/0833 ,  G06F3/03547 ,  G06F3/045 ,  G06F21/32 ,  G06F21/83 ,  G06F2203/04103 ,  G06F2203/04106 ,  G06K9/0002

Abstract: A separate control system may be configured for a combined sensor device. Alternatively, at least part of the control system may be included in another device, such as a processor of a mobile device. Software for handwriting, touch and fingerprint detection may be included in the control system. Low, medium and high resolution may be obtained with a single combined sensor device by scanning a subset of the sensels, or by aggregating lines or columns. Power consumption may be reduced by aggregating sensor pixels (or rows or columns) electrically using the controller, so that they perform as a low power small array until higher resolution with a larger array is needed. Power consumption may be reduced by turning off portions or all of the sensor device, turning off parts of the control system, and/or employing first-level screening at a reduced frame rate.

Abstract translation: 可以为组合的传感器装置配置单独的控制系统。 或者，控制系统的至少一部分可以被包括在另一个设备中，例如移动设备的处理器。 用于手写，触摸和指纹检测的软件可能包含在控制系统中。 通过扫描感官的子集，或通过聚集线或列可以通过单个组合传感器装置获得低，中和高分辨率。 可以通过使用控制器电传感器传感器像素（或行或列）来降低功耗，从而使它们作为低功率小阵列执行，直到需要更大阵列的更高分辨率。 通过关闭部分或全部传感器设备，关闭控制系统的部件和/或以降低的帧速率采用第一级屏蔽，可以降低功耗。

公开(公告)号：WO2012054357A1

公开(公告)日：2012-04-26

申请号：PCT/US2011/056461

申请日：2011-10-14

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  GANAPATHI, Srinivasan, Kodaganallur ,  GRIFFITHS, Jonathan, Charles ,  BUCHAN, Nicholas Ian ,  BURNS, David, William

Inventor： GANAPATHI, Srinivasan, Kodaganallur ,  GRIFFITHS, Jonathan, Charles ,  BUCHAN, Nicholas Ian ,  BURNS, David, William

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G02B26/0833 ,  G06F3/03547 ,  G06F3/045 ,  G06F21/32 ,  G06F21/83 ,  G06F2203/04103 ,  G06F2203/04106 ,  G06K9/0002

Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, the combined sensor device may enable a single touchscreen to perform additional functions such as handwriting input and fingerprint recognition. In some implementations, these multiple features allow increased security through user authentication, and allow better capture of handwriting and a more interactive approach to user interfaces. A handheld mobile device such as a cell phone with the combined sensor device can enable an array of applications, such as using the mobile device as a gateway for user authentication to enable transactions and physical access; using the handwriting input function for signature recognition and transmittal for transaction applications; and/or using the handwriting input feature to automatically capture notes and other documents of students in an academic setting or employees in a corporate setting.

Abstract translation: 本公开提供了用于组合的传感器装置的系统，方法和装置。 在一些实施方式中，组合的传感器设备可以使单个触摸屏能够执行附加功能，例如手写输入和指纹识别。 在一些实现中，这些多个特征允许通过用户认证增加安全性，并且允许更好地捕获手写和更具交互性的用户界面方法。 诸如具有组合的传感器设备的手机的手持移动设备可以实现应用阵列，诸如使用移动设备作为用于用户认证的网关以实现事务和物理访问; 使用手写输入功能进行签名识别和传送用于交易应用; 和/或使用手写输入功能自动捕获在学术环境中的学生的笔记和其他文档，或者在公司环境中的员工。

公开(公告)号：WO2011136971A1

公开(公告)日：2011-11-03

申请号：PCT/US2011/032930

申请日：2011-04-18

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason

Inventor： ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason

IPC: G01C19/56 ,  G01P15/12

CPC classification number: G01C19/5769 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  H01L41/25 ,  H01L41/311 ,  H01L41/312 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49155

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device.

Abstract translation: 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用陀螺仪的计算机程序。 一些陀螺仪包括驱动框架，中心锚杆和设置在中心锚固件的相对侧上的多个驱动梁。 驱动梁可以将驱动框架连接到中心锚杆上。 驱动梁可以包括压电层，并且可以被配置为使得驱动框架在驱动梁的平面中扭转地摆动。 陀螺仪还可以包括检测质量块和多个压电感测光束。 至少一些组分可以由镀金属形成。 驱动框架可以设置在检验质量块内。 驱动梁可以限制驱动框架大致在驱动梁的平面内旋转。 这样的设备可以被包括在诸如移动显示设备的移动设备中。

公开(公告)号：WO2012054353A1

公开(公告)日：2012-04-26

申请号：PCT/US2011/056443

申请日：2011-10-14

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  BUCHAN, Nicholas Ian ,  GANAPATHI, Srinivasan, Kodaganallur ,  PETERSEN, Kurt, Edward

Inventor： BUCHAN, Nicholas Ian ,  GANAPATHI, Srinivasan, Kodaganallur ,  PETERSEN, Kurt, Edward

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G02B26/0833 ,  G06F3/03547 ,  G06F3/045 ,  G06F21/32 ,  G06F21/83 ,  G06F2203/04103 ,  G06F2203/04106 ,  G06K9/0002

Abstract: Fabrication methods for combined sensor devices include substantially transparent substrates and materials to increase the optical performance of underlying displays. A substantially transparent elastomeric material may be disposed between the substantially transparent substrates. Some fabrication processes utilize flexible substrates for at least a portion of the sensor device, and lend themselves to roll-to-roll processing for low cost.

Abstract translation: 用于组合的传感器装置的制造方法包括基本上透明的基板和材料以增加底层显示器的光学性能。 基本上透明的弹性体材料可以设置在基本透明的基底之间。 一些制造工艺利用用于传感器装置的至少一部分的柔性基板，并且以低成本为自己进行卷对卷加工。

公开(公告)号：WO2011136970A1

公开(公告)日：2011-11-03

申请号：PCT/US2011/032926

申请日：2011-04-18

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  STEPHANOU, Philip, Jason ,  ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BURNS, David, William ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur

Inventor： STEPHANOU, Philip, Jason ,  ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BURNS, David, William ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur

IPC: G01P15/125 ,  G01P15/18 ,  G01P15/08 ,  G01C19/56

CPC classification number: G01C19/5769 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  H01L41/25 ,  H01L41/311 ,  H01L41/312 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49155

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using x-axis gyroscopes, y-axis gyroscopes, z-axis gyroscopes, two-axis accelerometers and three-axis accelerometers. Combining fabrication processes for such devices can enable the monolithic integration of six inertial sensing axes on a single substrate, such as a single glass substrate. Such devices may be included in a mobile device, such as a mobile display device.

Abstract translation: 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的计算机程序，用于制造和使用x轴陀螺仪，y轴陀螺仪，z轴陀螺仪，双轴加速度计和三轴加速度计。 结合这样的装置的制造工艺可以使六个惯性感测轴在单个衬底（例如单个玻璃衬底）上的单片集成。 这样的设备可以被包括在诸如移动显示设备的移动设备中。

公开(公告)号：WO2011136969A1

公开(公告)日：2011-11-03

申请号：PCT/US2011/032920

申请日：2011-04-18

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason

Inventor： ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason

IPC: G01C19/56

CPC classification number: G01C19/5769 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  H01L41/25 ,  H01L41/311 ,  H01L41/312 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49155

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device.

Abstract translation: 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用陀螺仪的计算机程序。 这种陀螺仪可以包括中心锚固体，围绕中心锚固设置的感测框架，被配置用于将感测框架连接到中心锚固件的多个感测梁和设置在感测框架周围并耦合到感测框架的驱动框架。 陀螺仪可以包括设置在感测框架的相对侧上的成对的驱动梁。 陀螺仪可以包括驱动框架悬架，用于将驱动框架的驱动运动基本上限制为沿着第一轴线的基本上线性的位移。 感测框架可以基本上与驱动框架的驱动运动分离。 这样的设备可以被包括在诸如移动显示设备的移动设备中。

公开(公告)号：WO2013032728A3

公开(公告)日：2013-07-25

申请号：PCT/US2012051216

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

Inventor： PETERSEN KURT EDWARD ,  SHENOY RAVINDRA V ,  BLACK JUSTIN PHELPS ,  BURNS DAVID WILLIAM ,  GANAPATHI SRINIVASAN KODAGANALLUR ,  STEPHANOU PHILIP JASON ,  BUCHAN NICHOLAS IAN

IPC: B81B7/00

CPC classification number: B81B7/0067 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0109 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  Y10T29/5313 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）设备的玻璃封装的系统，方法和设备。 在一个方面中，玻璃封装件可以包括玻璃基板，覆盖玻璃，封装在玻璃基板与盖玻璃之间的一个或多个器件，以及被配置成附接到柔性连接器并且与封装器件电连通的接合焊盘。 在一些实施方式中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的电部件，例如集成电路（IC）器件或PCB。