A Method for producing an optoelectronic device (10) with the following steps is specified: -providing an housing base body, wherein the housing base body (1) is formed with a plastic material, -forming a recess (2) in the housing base body, wherein the recess (2) is confined by a bottom surface (2a) and at least one side wall (2b) which are formed at least in places by the plastic material of the base body, -providing a optoelectronic semiconductor chip (3), wherein the optoelectronic semiconductor chip (3) has a first main surface (3a), a second main surface (3b) facing away from the first main surface (3a) and at least one side surface (3c) connecting the first main surface (3a) and the second main surface (3b) with each other, -placing the optoelectronic semiconductor chip (3) in the recess, wherein the first main surface (3a) is brought in contact with the bottom surface (2a) and the at least one side surface (3c) is brought in contact with the at least one side wall, wherein -the plastic material comprises a self-healing polymer material.