Invention Application
- Patent Title: EDGE GRIP SUBSTRATE HANDLER
- Patent Title (中): 边缘基板处理器
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Application No.: PCT/US2013/077102Application Date: 2013-12-20
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Publication No.: WO2014107351A1Publication Date: 2014-07-10
- Inventor: SATO, Isao , UENO, Hiroki , ITO, Yasutoshi , RYU, Masataka , PALM, Troy
- Applicant: RUDOLPH TECHNOLOGIES, INC.
- Applicant Address: One Rudolph Road Flanders, New Jersey 07836 US
- Assignee: RUDOLPH TECHNOLOGIES, INC.
- Current Assignee: RUDOLPH TECHNOLOGIES, INC.
- Current Assignee Address: One Rudolph Road Flanders, New Jersey 07836 US
- Agency: FRONEK, Todd R. et al.
- Priority: US61/748,965 20130104
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/677 ; B65G49/07 ; B25J15/00
Abstract:
A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.
Information query
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