WAFER CRACK DETECTION
    1.
    发明申请

    公开(公告)号:WO2020150481A1

    公开(公告)日:2020-07-23

    申请号:PCT/US2020/013890

    申请日:2020-01-16

    Inventor: SEEGER, Hartmut

    Abstract: A method for identifying cracks in non-planar substrates is herein disclosed. Images of a substrate in a relaxed state are captured and assessed to identify cracks, if any. Assessment may be conducted optically using broad band illumination, laser illumination, or infrared illumination. Mechanisms for carrying out the method are also disclosed.

    METHOD OF MEASURING AND ASSESSING A PROBE CARD WITH AN INSPECTION DEVICE
    3.
    发明申请
    METHOD OF MEASURING AND ASSESSING A PROBE CARD WITH AN INSPECTION DEVICE 审中-公开
    用检测装置测量和评估探针卡的方法

    公开(公告)号:WO2015188093A1

    公开(公告)日:2015-12-10

    申请号:PCT/US2015/034470

    申请日:2015-06-05

    Inventor: OLMSTEAD, Greg

    CPC classification number: G01R31/2886 G01R3/00 G01R35/00

    Abstract: A method of assessing functionality of a probe card includes providing a probe card analyzer without a probe card interface, removably coupling a probe card having probes to a support plate of the probe card analyzer, aligning a sensor head of the probe card analyzer with the probe card, and measuring a component of the probes with the sensor head.

    Abstract translation: 一种评估探针卡的功能的方法包括提供无探针卡接口的探针卡分析仪,将具有探针的探针卡可移除地耦合到探针卡分析仪的支撑板,将探针卡分析仪的传感器头与探头对准 卡,并用传感器头测量探头的一个部件。

    EDGE GRIP SUBSTRATE HANDLER
    4.
    发明申请
    EDGE GRIP SUBSTRATE HANDLER 审中-公开
    边缘基板处理器

    公开(公告)号:WO2014107351A1

    公开(公告)日:2014-07-10

    申请号:PCT/US2013/077102

    申请日:2013-12-20

    CPC classification number: H01L21/68707 B25J11/0095 B25J15/0014 H01L21/67259

    Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.

    Abstract translation: 公开了一种用于处理诸如半导体晶片的衬底的机构。 该机构以倾斜方向支撑衬底,以确保弓形衬底和机构之间不会发生不期望的接触。 以倾斜方向支撑衬底的结构可以是固定的或可调节的。 可以提供传感器来测量和/或监测衬底和机构之间的距离。 或者,可以提供用于确定基板和机构之间的接触的传感器。

    ON-AXIS FOCUS SENSOR AND METHOD
    5.
    发明申请
    ON-AXIS FOCUS SENSOR AND METHOD 审中-公开
    轴对焦传感器和方法

    公开(公告)号:WO2013096660A1

    公开(公告)日:2013-06-27

    申请号:PCT/US2012/071030

    申请日:2012-12-20

    Abstract: A focus height sensor in an optical system for inspection of semiconductor devices includes a sensor beam source that emits a beam of electromagnetic radiation. A reflector receives the beam of electromagnetic radiation from the sensor beam source and directs the beam toward a surface of a semiconductor device positioned within a field of view of the optical system. The reflector is positioned to receive at least a portion of the beam back from the surface of the semiconductor device to direct the returned beam to a sensor. The sensor receives the returned beam and outputs a signal correlating to a position of the surface within the field of view along an optical axis of the optical system.

    Abstract translation: 用于检查半导体器件的光学系统中的焦点高度传感器包括发射电磁辐射束的传感器光束源。 反射器接收来自传感器光束源的电磁辐射束,并将光束引向位于光学系统的视野内的半导体器件的表面。 反射器定位成从半导体器件的表面接收光束的至少一部分,以将返回的光束引导到传感器。 传感器接收返回的光束,并沿着光学系统的光轴输出与视场内的表面的位置相关的信号。

    WAFER SCANNING
    8.
    发明申请
    WAFER SCANNING 审中-公开
    WAFER扫描

    公开(公告)号:WO2006132998A2

    公开(公告)日:2006-12-14

    申请号:PCT/US2006021531

    申请日:2006-06-02

    CPC classification number: G01N21/9501 H01L21/67288

    Abstract: A semiconductor wafer measuring device including a wafer mover adapted to move a semiconductor wafer; a measurement head adapted to scan a surface of the semiconductor wafer as the semiconductor wafer is moved by the wafer mover; and a controller. The controller is adapted to control movement of the wafer mover to provide a first scanning segment of a first portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the first scanning segment, a second scanning segment of a second different portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the second scanning segment; and rotating the semiconductor wafer between the first and second scanning segments.

    Abstract translation: 一种半导体晶片测量装置,包括适于移动半导体晶片的晶片移动器; 测量头,其适于在晶片移动器移动半导体晶片时扫描半导体晶片的表面; 和控制器。 控制器适于控制晶片移动器的运动,以在半导体晶片的表面的第一部分提供第一扫描段,而不在第一扫描段期间旋转半导体晶片,第二扫描段的第二不同部分 在第二扫描段期间不使半导体晶片旋转的半导体晶片的表面; 以及在第一和第二扫描段之间旋转半导体晶片。

    COMBINED ULTRA-FAST X-RAY AND OPTICAL SYSTEM FOR THIN FILM MEASUREMENTS

    公开(公告)号:WO2006124475A3

    公开(公告)日:2006-11-23

    申请号:PCT/US2006/018148

    申请日:2006-05-10

    Abstract: A system comprising a means for generating an optical pump beam pulse (15) and for directing the optical pump beam pulse (15) to a first area of a surface of a sample (27) having a plurality of film layers to generate an acoustic signal, a means for generating an x-ray probe pulse (17) and for directing the x-ray probe pulse (17) to a second area of the surface, a means for detecting (33) an intensity of a diffracted x-ray probe pulse (17') the intensity varying in response to the acoustic signal to form a probe pulse response signal, and a means for calculating (51) an expected transient response to a theoretical acoustic signal propagated through a model of the sample and fitting the probe pulse response to the transient response to derive at least one characteristic of the sample (27).

    METROLOGY SYSTEM WITH SPECTROSCOPIC ELLIPSOMETER AND PHOTOACOUSTIC MEASUREMENTS
    10.
    发明申请
    METROLOGY SYSTEM WITH SPECTROSCOPIC ELLIPSOMETER AND PHOTOACOUSTIC MEASUREMENTS 审中-公开
    光谱仪和光电测量仪器系统

    公开(公告)号:WO2003008939A1

    公开(公告)日:2003-01-30

    申请号:PCT/US2002/022223

    申请日:2002-07-12

    CPC classification number: G01B11/0666 G01N21/1702 G01N21/211 G01N2021/1725

    Abstract: An optical system includes both a microspot broadband spectroscopic ellipsometer (410) and a photoacoustic film thickness measurement system (415) that are supplied laser light by the same laser light source. One of the systems makes a measurement, the result of which is used to adjust a parameter of the other system; e.g. the ellipsometer (410) measures thickness and the photoacoustic system (415) uses the thickness result to measure the speed of the sound. In one version, the ellipsometer converts the laser beam to a broad-spectrum beam that provides higher intensity .

    Abstract translation: 光学系统包括通过相同的激光源提供激光的微带宽带分光椭偏仪(410)和光声膜厚度测量系统(415)。 其中一个系统进行测量,其结果用于调整另一个系统的参数; 例如 椭偏仪(410)测量厚度,并且光声系统(415)使用厚度结果来测量声音的速度。 在一个版本中,椭偏仪将激光束转换成提供更高强度的广谱光束。

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