Invention Application
- Patent Title: ELECTRONIC SUB-ASSEMBLY, METHOD FOR THE PRODUCTION THEREOF AND PRINTED CIRCUIT BOARD HAVING AN ELECTRONIC SUB-ASSEMBLY
- Patent Title (中): 电子元件，其制造方法以及具有电子元件的导体板
-
Application No.: PCT/EP2014000631Application Date: 2014-03-11
-
Publication No.: WO2014139666A8Publication Date: 2014-11-06
- Inventor: GOTTWALD THOMAS , NEUMANN ALEXANDER
- Applicant: SCHWEIZER ELECTRONIC AG
- Assignee: SCHWEIZER ELECTRONIC AG
- Current Assignee: SCHWEIZER ELECTRONIC AG
- Priority: DE102013102541 2013-03-13
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/367 ; H01L23/538
Abstract:
The invention relates to an electronic sub-assembly comprising a carrier layer and a component region with at least one electronic component, the carrier layer having, at least in sections, a material with a low coefficient of thermal expansion to adapt the coefficient of thermal expansion of the carrier layer, and the carrier layer, in addition to the component region, having at least one compensation layer on which an electrically insulating, thermally conducting layer and at least one electrically conductive layer are provided.
Information query
IPC分类:
