A microlithographic projection exposure apparatus (10) comprises a correction device (40) that is configured to correct optical wavefront deformations and comprises a first optical element (42a), a second optical element (42b) and a drive mechanism (44) that is configured to move the first and second optical elements between a first arrangement and a second arrangement. In the first arrangement the first optical element (42a) is an inner optical element having at least a portion that is arranged in a projection light path (PLP), and the second optical element (42b) is an outer optical element that is arranged completely outside the projection light path. In the second arrangement the second optical element is the inner optical element and the first optical element is the outer optical element. The correction device further comprises a temperature control device (50a, 50b) that is configured to modify a temperature distribution in the outer optical element.