Abstract:
An illumination system of a microlithographic projection exposure apparatus comprises a first and a second optical raster plate (54a). An irradiance distribution of projection light on the first and second optical raster plate determines an angular light distribution of the projection light exclusively at a first portion (60a) and a second portion, respectively, of an illuminated field. The second portion is distinct from and arranged adjacent to the first portion. This makes it possible to produce different illumination settings in different adjacent portions (60a, 60b) on the mask (14). First and second Fourier optics (58a, 58b) establish a Fourier relationship between the first and second optical raster plates one the one hand and the first and second portion on the other hand. The first and second Fourier optics (58a) have a first and second focal length, respectively, that are variable in response to a focal length change command signal from a control unit (45).
Abstract:
A microlithographic projection exposure apparatus (10) comprises a correction device (40) that is configured to correct optical wavefront deformations and comprises a first optical element (42a), a second optical element (42b) and a drive mechanism (44) that is configured to move the first and second optical elements between a first arrangement and a second arrangement. In the first arrangement the first optical element (42a) is an inner optical element having at least a portion that is arranged in a projection light path (PLP), and the second optical element (42b) is an outer optical element that is arranged completely outside the projection light path. In the second arrangement the second optical element is the inner optical element and the first optical element is the outer optical element. The correction device further comprises a temperature control device (50a, 50b) that is configured to modify a temperature distribution in the outer optical element.
Abstract:
Es betrifft einen Bearbeitungskopf für eine Laserbearbeitungsvorrichtung, die für die Bearbeitung eines Werkstücks (24) mit Laserstrahlung (30) eingerichtet ist. Der Laserbearbeitungskopf weist eine verstellbare Fokussieroptik (34) auf, welche die Laserstrahlung (30) in einem Brennfleck (22) fokussiert. Der Abstand des Brennflecks (22) zu einem Bearbeitungskopf ist durch Verändern der Brennweite der Fokussieroptik (34) veränderbar. Eine Scaneinrichtung (44) lenkt die Laserstrahlung (30) in unterschiedliche Richtungen ab. Ein optischer Kohärenztomographen (48) misst einen Abstand zwischen dem Bearbeitungskopf und dem Werkstück (24). Dabei interferiert in dem Kohärenztomographen (48) von einer Messlichtquelle (50) erzeugtes Messlicht (52), das von dem Werkstück (24) reflektiert wurde, mit Messlicht, das in einem Referenzarm (60) eine optische Weglänge zurückgelegt hat. Im Referenzarm (60) ist ein Weglängenmodulator (74) angeordnet, der synchron zu und in Abhängigkeit von einer Veränderung der Brennweite der Fokussieroptik (34) die optische Weglänge im Referenzarm (60) nachführt.
Abstract:
A microlithographic apparatus (10) comprises an objective (20) that comprises a transmission filter (42) that is configured to variably modify a light irradiance distribution in a projection light path. The transmission filter (42) comprises a plurality of gas outlet apertures (44, 144) that are configured to emit gas flows (72, 172) that pass through a space (55) through which projection light (PL) propagates during operation of the microlithographic apparatus (10). The transmission filter (42) further comprises a control unit (48) which is configured to vary a number density of ozone molecules in the gas flows (72, 172) individually for each gas flow. In this manner it is possible to finally adjust the transmittance distribution (TD42) of the transmission filter (42).
Abstract:
A projection objective of a microlithographic projection apparatus comprises a wavefront correction device (42) comprising a mirror substrate (44; 44a, 44b) that has two opposite optical surfaces (46, 48), through which projection light passes, and a circumferential rim surface (50) extending between the two optical surfaces (46, 48). A first and a second optical system (OS1, OS2) are configured to direct first and second heating light (HL1, HL2) to different portions of the rim surface (50) such that at least a portion of the first and second heating light enters the mirror substrate (44; 44a, 44b). A temperature distribution caused by a partial absorption of the heating light (HL1, HL2) results in a refractive index distribution inside the mirror substrate (44; 44a, 44b) that corrects a wavefront error. At least the first optical system (OS1) comprises a focusing optical element (55) that focuses the first heating light in a focal area (56) such that the first heating light emerging from the focal area (56) impinges on the rim surface (50).
Abstract:
In a method for operating a microlithographic projection exposure apparatus, a facet mirror (72) is illuminated with projection light (PL) having a center wavelength of between 5 nm and 30 nm. The facet mirror (72) has a plurality of adjustable mirror facets (86), wherein groups of adjacent mirror facets (86) form regions (88) which are imaged by an optical unit (83, 76, 78, 80) onto an object plane (30) of a projection objective (20) of the projection exposure apparatus (10). There the images of the regions (88) are superimposed in an object field (88'). An illumination field (24), which is identical to the object field (88') or to a part thereof, is illuminated with the projection light (PL). A mask (16) containing structures (12) to be imaged is moved in the object plane (30) of the projection objective (26) in such a way that the illumination field (24) scans over the mask (16). According to the invention, during step c) the size of the illumination field (24) is varied by adjusting at least one mirror facet (86).
Abstract:
A microlithographic apparatus (10) comprises an optical wavefront manipulator (42). The latter includes an optical element (44) and a gas-tight cavity (50) that is partly confined by the optical element (44) or contains it. A gas inlet device (58) directs a gas jet (86a, 86b) towards the optical element (44). The location, where the gas jet impinges on the optical element after it has passed through the cavity, is variable in response to a control signal supplied by a control unit (84). A gas outlet (64, 66) is in fluid connection with the vacuum pump (60, 62) so that, upon operation of the vacuum pump, the pressure within the cavity is less than 10 mbar even if the gas jet (86a, 86b) passes through the cavity (50).
Abstract:
A microlithographic apparatus (10) comprises an optical wave- front manipulator (42). The latter includes an optical element (44) and a gas-tight cavity (50) that is partly confined by the optical element (44) or contains it. A gas inlet device (58) directs a gas jet (86a, 86b) towards the optical element (44). The location, where the gas jet impinges on the optical element after it has passed through the cavity, is variable in response to a control signal supplied by a control unit (84). A gas outlet (64, 66) is in fluid connection with the vacuum pump (60, 62) so that, upon operation of the vacuum pump, the pressure within the cavity is less than 10 mbar even if the gas jet (86a, 86b) passes through the cavity (50).
Abstract:
An illumination system of a microlithographic projection exposure apparatus comprises a light modulator (38) which includes a modulator substrate (70) and an array of mirrors (42a, 42b, 42c) that are supported by the modulator substrate (70). At least some adjacent mirrors partly overlap. The light modulator further comprises a plurality of actuators (86, 88) that are supported by the modulator substrate (70) and are configured to tilt the mirrors (42a, 42b, 42c) individually.
Abstract:
An illumination system of a microlithographic projection exposure apparatus (10) comprises an optical integrator (60) having a plurality of light entrance facets (100) and a beam deflection array (38) of reflective or transparent beam defleeting elements (40). Each beam deflecting element (40) is configured to illuminate a spot (98) on the optical integrator (609 at a position that is variable by changing a deflection angle produced by the beam deflecting element (40). The illumination system further comprises a control unit (90) which is configured to control the beam deflection elements (40) in such a manner that a light pattern (108, 114, 118) assembled from the spots (98) on at least one of the light entrance facets (100) is varied in response to an input command that a field dependency of the angular irradiance distribution in a mask plane (88) shall be modified.