Abstract:
The invention relates to a projection exposure apparatus (400, 100) comprising a projection objective (408, 107, 200), the projection objective (408, 107, 200) comprising an optical device (1), the optical device (1) comprising an optical element (2) having an optically effective surface (2a) and at least one electrostrictive actuator (3), which is deformable by a control voltage being applied, wherein the electrostrictive actuator (3) is functionally connected to the optical element (2) in order to influence the surface shape of the optically effective surface (2a). A control device (4) is provided in order to supply the electrostrictive actuator (3) with the control voltage, wherein a measuring device (5) is provided, which is configured, at least at times while the electrostrictive actuator (3) influences the optically effective surface (2a) of the optical element (2), to measure directly and/or to determine indirectly the temperature and/or a temperature change of the electrostrictive actuator (3) and/or the surroundings thereof in order to take account of a temperature-dependent influence during driving of the electrostrictive actuator (3) by the control device (4).
Abstract:
A stop (300), in particular numerical aperture stop, obscuration stop or false-light stop, for a lithography apparatus (100A, 100B), comprising a light-transmissive aperture (302) and at least one stop element (306, 308), in which or at which the 5 aperture (302) is provided, wherein the stop element (306, 308) is opaque and fluid- permeable outside the aperture (302).
Abstract:
The invention relates to a mirror, in particular for a microlithographic projection exposure apparatus. In accordance with one aspect, a mirror according to the invention has an optical effective surface (11, 31), a mirror substrate (12, 32), a reflection layer system (21, 41) for reflecting electromagnetic radiation that is incident on the optical effective surface, and at least one piezoelectric layer (16, 36), which is arranged between the mirror substrate and the reflection layer system and to which an electric field for producing a locally variable deformation is able to be applied by way of a first electrode arrangement situated on the side of the piezoelectric layer facing the reflection layer system, and by way of a second electrode arrangement situated on the side of the pie- zoelectric layer facing the mirror substrate, wherein one of said electrode arrangements is assigned a mediator layer (17, 37, 51, 52, 53, 71) for setting an at least regionally continuous profile of the electrical potential along the respective electrode arrangement; and wherein said mediator layer has at least two mutually electrically insulated regions (17a, 17b, 17c,…; 37a, 37b, 37c,…).
Abstract:
The invention relates to a method and an apparatus for determining the heating state of an optical element in a microlithographic optical system, wherein the method includes the following steps: producing, using a light source (303), a first partial beam (310) that is transmitted through the optical element (200, 300) and a second partial beam (320) that is not transmitted through the optical element, and determining the heating state of the optical element on the basis of a measurement of the time-of-flight difference between the first partial beam and the second partial beam, wherein the first partial beam (310) and the second partial beam (320) are reflected at different faces of the optical element (200, 300).
Abstract:
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Bestimmen des Erwärmungszustandes eines optischen Elements in einem optischen System für die Mikrolithographie, wobei wenigstens ein berührungsloser, auf dem Empfang elektromagnetischer Strahlung von dem optischen Element (301, 401, 402, 403, 501, 502, 503, 504, 601) basierender Sensor (330, 430, 531, 532, 533, 534, 631, 632) verwendet wird, und wobei zur Ermittlung einer Temperaturverteilung in dem optischen Element der von dem Sensor (330, 430, 531, 532, 533, 534, 631, 632) erfasste Strahlungsbereich variiert wird.
Abstract:
Die Erfindung betrifft einen Spiegel, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage, wobei der Spiegel eine optische Wirkfläche aufweist, mit einem Substrat (11, 61, 71, 81, 91), einem Reflexionsschichtsystem (16, 66, 76, 86, 96) zur Reflexion von auf die optische Wirkfläche (10a, 60a, 70a, 80a, 90a) auftreffender elektromagnetischer Strahlung, einer auf dem Substrat (11, 61, 71, 81, 91) vorgesehenen Elektrodenanordnung (13, 63, 73, 83) aus einem ersten Material mit einer ersten elektrischen Leitfähigkeit und einer Vermittlerschicht (12, 62, 72, 82, 92) aus einem zweiten Material mit einer zweiten elektrischen Leitfähigkeit, wobei das Verhältnis zwischen der ersten und der zweiten elektrischen Leitfähigkeit wenigstens 100 beträgt, wobei der Spiegel wenigstens eine Kompensationsschicht (88) aufweist, welche den Einfluss einer thermischen Ausdehnung der Elektrodenanordnung (83) auf die Deformation der optischen Wirkfläche (80a) wenigstens teilweise kompensiert.
Abstract:
An attenuation filter (AF, AF', AF1, AF2, AF3) is configured for the defined attenuation of the intensity of ultraviolet radiation (LR1I, LR2I) with a specified working wavelength from a wave-length range of 150 nm to 370 nm according to a specifiable local distribution in a projection lens (PO, PO') of a microlithographic projection exposure apparatus (WSC). The attenuation filter has a substrate (SU, SU') and an absorption layer (AL). The substrate is sufficiently transparent at the working wavelength. The absorption layer is arranged on the substrate and absorbs incident ultraviolet radiation of the working wavelength according to the specifiable local distribution at different locations (Z1, Z2) of a used area (UA) to varying degrees. The attenuation filter is designed for reducing or avoiding a thermally induced wavefront variation error in the ultraviolet radiation (LR1O, LR2O) which has passed through the attenuation filter owing to locally varying heating of the substrate, which is caused by the absorption of the ultraviolet radiation that varies locally over the substrate. A thickness (TS) of the substrate (SU) is less than 100 µm.
Abstract:
A microlithographic apparatus comprises a light source producing projection light having a center wavelength λ and a projection objective having an optical axis and a transmission filter system. The latter comprises a first and a second diffractive optical element (44, 46). A drive (48) is configured to change the relative position between the first and the second diffractive optical element between an active position, in which the combination of the two diffractive optical elements diffracts more projection light on a light absorbing element than in a neutral position. The axial distance Δz between the two diffractive optical elements (44, 46) fulfils the condition 0 ≤Δz ≤ 3λ.
Abstract:
An illumination intensity correction device (24) serves for predefining an illumination intensity over an illumination field (18) of a lithographic projection exposure apparatus. The correction device (24) has a plurality of bar-shaped individual stops (27) arranged alongside one another and having bar axes (28) arranged parallel to one another, which are arranged in a manner lined up alongside one another transversely with respect to the bar axes. The individual stops (27) are displaceable into a predefined intensity correction displacement position at least along their respective bar axis (28) with the aid of a displacement drive (29) individually for the purpose of predefining an intensity correction of an illumination of the illumination field (18). At least some of the individual stops (27 FB ) are embodied as field delimiting individual stops such that they are displaceable along their bar axis (28) between a completely extended extension position and a completely retracted retraction position by more than a field extent (18 y ) of the illumination field (18) which the latter has along the bar axis (28). This results in an illumination intensity correction device having an improved correction accuracy in comparison with the prior art.
Abstract:
A projection exposure apparatus (10) for microlithography comprises a measuring system (50) for measuring an optical element of the projection exposure apparatus. The measuring system (50) comprises: an irradiation device (54), which is configured to radiate measuring radiation (62) in different directions (64) onto the optical element (20), such that the measuring radiation (62) covers a respective optical path length (68) within the optical element (20) for the different directions (64) of incidence, a detection device (56), which is configured to measure, for the respective direction (64) of incidence, the corresponding optical path length covered by the measuring radiation (62) in the optical element (20), and an evaluation device, which is configured to determine a spatially resolved distribution of the refractive index in the optical element (20) by computed-tomographic back projection of the measured path lengths taking account of the respective direction of incidence.