Methods of fabricating middle of line (MOL) layers and devices including MOL layers. A method in accordance with an aspect of the present disclosure includes depositing a hard mask (500) across active contacts (112) to terminals of semiconductor devices of a semiconductor substrate. Such a method also includes patterning the hard mask to selectively expose some of the active contacts (112-5) and selectively insulate some of the active contacts (112-2). The method also includes depositing a conductive material (1100) on the patterned hard mask and the exposed active contacts to couple the exposed active contacts to each other over an active area of the semiconductor devices.