Invention Application
WO2015111898A1 ELECTRODE CONNECTING STRUCTURE INCLUDING ADHESION LAYER AND ELECTRONIC DEVICE INCLUDING THE SAME
审中-公开
包括粘合层的电极连接结构和包括其的电子器件
- Patent Title: ELECTRODE CONNECTING STRUCTURE INCLUDING ADHESION LAYER AND ELECTRONIC DEVICE INCLUDING THE SAME
- Patent Title (中): 包括粘合层的电极连接结构和包括其的电子器件
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Application No.: PCT/KR2015/000581Application Date: 2015-01-20
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Publication No.: WO2015111898A1Publication Date: 2015-07-30
- Inventor: LEE, Jaeho , LEE, Changseok , PARK, Seongjun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: 129, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 443-742 KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: 129, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 443-742 KR
- Agency: Y.P.LEE, MOCK & PARTNERS
- Priority: KR10-2014-0007473 20140121
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L29/78
Abstract:
Provided are an electrode connecting structure that includes an adhesion layer formed between a graphene layer and a metal layer and an electronic device having the electrode connecting structure. The electrode connecting structure may include an adhesion layer formed of a two-dimensional material provided between the graphene layer and the metal layer. The graphene layer may be a diffusion barrier, and the adhesion layer may stably maintain the interface characteristics of the graphene layer and the metal layer when the metal layer is formed on a surface of the graphene layer.
Information query
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