公开(公告)号：WO2015126139A1

公开(公告)日：2015-08-27

申请号：PCT/KR2015/001595

申请日：2015-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： LEE, Changseok ,  SHIN, Hyeonjin ,  PARK, Seongjun ,  IM, Donghyun ,  PARK, Hyun ,  SHIN, Keunwook ,  LEE, Jongmyeong ,  LIM, Hanjin

IPC: H01L21/768 ,  C01B31/04

CPC classification number: H01L23/53276 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Example embodiments relate to a wiring structure, a method of forming the same, and an electronic device employing the same. The wiring structure includes a first conductive material layer and a nanocrystalline graphene layer on the first conductive material layer in direct contact with the metal layer.

Abstract translation: 示例性实施例涉及布线结构，其形成方法和使用该布线结构的电子设备。 布线结构包括与金属层直接接触的第一导电材料层上的第一导电材料层和纳米晶体石墨烯层。

公开(公告)号：WO2015111898A1

公开(公告)日：2015-07-30

申请号：PCT/KR2015/000581

申请日：2015-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： LEE, Jaeho ,  LEE, Changseok ,  PARK, Seongjun

IPC: H01L29/41 ,  H01L29/78

CPC classification number: H01L29/41725 ,  H01L21/76831 ,  H01L21/76844 ,  H01L21/76846 ,  H01L23/485 ,  H01L23/5226 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/53276 ,  H01L29/1606 ,  H01L29/417 ,  H01L29/78 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are an electrode connecting structure that includes an adhesion layer formed between a graphene layer and a metal layer and an electronic device having the electrode connecting structure. The electrode connecting structure may include an adhesion layer formed of a two-dimensional material provided between the graphene layer and the metal layer. The graphene layer may be a diffusion barrier, and the adhesion layer may stably maintain the interface characteristics of the graphene layer and the metal layer when the metal layer is formed on a surface of the graphene layer.

Abstract translation: 提供一种电极连接结构，其包括形成在石墨烯层和金属层之间的粘合层和具有电极连接结构的电子器件。 电极连接结构可以包括由设置在石墨烯层和金属层之间的二维材料形成的粘合层。 石墨烯层可以是扩散阻挡层，并且当金属层形成在石墨烯层的表面上时，粘合层可以稳定地保持石墨烯层和金属层的界面特性。