Invention Application
WO2015175554A2 CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE
审中-公开
导电连接，具有这种连接的结构以及制造方法
- Patent Title: CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE
- Patent Title (中): 导电连接，具有这种连接的结构以及制造方法
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Application No.: PCT/US2015/030410Application Date: 2015-05-12
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Publication No.: WO2015175554A2Publication Date: 2015-11-19
- Inventor: KATKAR, Rajesh , UZOH, Cyprian, Emeka
- Applicant: INVENSAS CORPORATION
- Applicant Address: 3025 Orchard Parkway San Jose, CA 95134 US
- Assignee: INVENSAS CORPORATION
- Current Assignee: INVENSAS CORPORATION
- Current Assignee Address: 3025 Orchard Parkway San Jose, CA 95134 US
- Agency: LATTIN, Christopher, W.
- Priority: US14/275,514 20140512
- Main IPC: H01L21/60
- IPC: H01L21/60
Abstract:
In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.
Information query
IPC分类:
