A method of manufacturing a surface mount device (100, 900) includes providing at least one core device (120, 920) and at least one lead frame (310). The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant (125, 925). The encapsulant includes a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm 3 ⋅mm/m 2 ⋅atm⋅day. Another method of manufacturing a surface mount device includes forming a plaque (1105) from a material, forming a plurality of conductive protrusions (915) on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. When cured, the encapsulant has an oxygen permeability of less than about 0.4 cm 3 ⋅mm/m 2 ⋅atm⋅day. The assembly is cut to provide a plurality of components (1120a-c). After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.