公开(公告)号：WO2016061094A1

公开(公告)日：2016-04-21

申请号：PCT/US2015/055313

申请日：2015-10-13

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： SEPULVEDA, Mario, G. ,  PINEDA, Martin, G. ,  VRANICAR, Anthony ,  BHATAWADEKAR, Kedar, V. ,  NGO, Minh, V. ,  NITZAN, Dov

IPC: H01C1/034 ,  H01C7/02 ,  H01C17/065 ,  H01C1/14

CPC classification number: H01C1/034 ,  H01C1/1406 ,  H01C7/028 ,  H01C17/065

Abstract: A method of manufacturing a surface mount device (100, 900) includes providing at least one core device (120, 920) and at least one lead frame (310). The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant (125, 925). The encapsulant includes a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm 3 ⋅mm/m 2 ⋅atm⋅day. Another method of manufacturing a surface mount device includes forming a plaque (1105) from a material, forming a plurality of conductive protrusions (915) on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. When cured, the encapsulant has an oxygen permeability of less than about 0.4 cm 3 ⋅mm/m 2 ⋅atm⋅day. The assembly is cut to provide a plurality of components (1120a-c). After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.

Abstract translation: 制造表面贴装装置（100,900）的方法包括提供至少一个芯装置（120,920）和至少一个引线框架（310）。 核心设备连接到引线框架。 核心器件和引线框架封装在密封剂（125,925）内。 密封剂包括液态环氧树脂，其在固化时的透氧度小于约0.4cm 3·mm / m 2·atm·天。 制造表面安装装置的另一种方法包括从材料形成一个板（1105），在该板的顶表面和一个底表面上形成多个导电凸起（915），并在至少一部分上施加液体密封剂 的顶表面和板的底表面的至少一部分。 当固化时，密封剂的氧气渗透性小于约0.4cm 3·mm / m 2·atm·day。 组件被切割以提供多个部件（1120a-c）。 在切割之后，每个部件的顶表面包括至少一个导电突起，每个部件的底表面包括至少一个导电突起，每个部件的顶表面和底表面包括固化的密封剂，以及每个部件的芯部 包括材料。