A build-up layer may be fabricated by forming a microelectronic dielectric layer comprising a dielectric material with a metallization catalyst dispersed therein, forming a primer layer on the microelectronic dielectric layer, and forming a recess through the primer layer and into the dielectric material layer. An activation layer may be formed in or on the exposed microelectronic dielectric layer within the recess, wherein the primer layer acts as a mask. A metal layer may be formed on the activation layer, such as with an electroless process. Thus, the resolution of the metal layer deposition may be precisely controlled by the process used to form the recess.