发明申请
- 专利标题： ENGINEERED POLYMER-BASED ELECTRONIC MATERIALS
- 专利标题（中）： 工程聚合物电子材料
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申请号： PCT/GB2016/050910申请日： 2016-03-31
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公开(公告)号： WO2016156853A1公开(公告)日： 2016-10-06
- 发明人: VENKATAGIRIYAPPA, Ramakrishna Hosur , DE AVILA RIBAS, Morgana , DAS, Barun , SIDDAPPA, Harish Hanchina , MUKHERJEE, Sutapa , SARKAR, Siuli , SINGH, Bawa , RAUT, Rahul , PANDHER, Ranjit
- 申请人： ALPHA METALS, INC. , ROHAN, Setna
- 申请人地址： 109 Corporate Blvd. South Plainfield, New Jersey 07080 US
- 专利权人： ALPHA METALS, INC.,ROHAN, Setna
- 当前专利权人： ALPHA METALS, INC.,ROHAN, Setna
- 当前专利权人地址： 109 Corporate Blvd. South Plainfield, New Jersey 07080 US
- 优先权： IN630/DEL/2015 20150401
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K35/00 ; C08K3/00 ; C08K3/04 ; C08K5/00 ; C08K7/02 ; C08L83/04 ; H01L21/00 ; H01L23/00
摘要：
A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.
IPC分类:
