公开(公告)号：WO2016156853A1

公开(公告)日：2016-10-06

申请号：PCT/GB2016/050910

申请日：2016-03-31

Applicant: ALPHA METALS, INC. ,  ROHAN, Setna

Inventor： VENKATAGIRIYAPPA, Ramakrishna Hosur ,  DE AVILA RIBAS, Morgana ,  DAS, Barun ,  SIDDAPPA, Harish Hanchina ,  MUKHERJEE, Sutapa ,  SARKAR, Siuli ,  SINGH, Bawa ,  RAUT, Rahul ,  PANDHER, Ranjit

IPC: B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

CPC classification number: B23K35/3613 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3602 ,  B23K2201/42 ,  C08K3/013 ,  C08K3/04 ,  C08K3/042 ,  C08K5/00 ,  C08K5/549 ,  C08K7/02 ,  H01L23/295 ,  H01L23/296 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1141 ,  H01L2224/11418 ,  H01L2224/11422 ,  H01L2224/1301 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13386 ,  H01L2224/13387 ,  H01L2224/13393 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13486 ,  H01L2224/13487 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/27422 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29486 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2224/81856 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2224/8321 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/3841 ,  C08L63/00 ,  C08L83/04 ,  C08K5/092 ,  C08K5/18 ,  C08K5/49 ,  C08L2205/025 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/05341 ,  H01L2924/07001 ,  H01L2924/0715 ,  H01L2924/0675 ,  H01L2924/0665 ,  H01L2924/06 ,  H01L2924/01079 ,  H01L2924/053 ,  H01L2924/01102 ,  H01L2924/01103 ,  H01L2924/01109 ,  H01L2924/01009 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/066 ,  H01L2924/0635 ,  H01L2924/061 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0542 ,  H01L2924/0103

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.

Abstract translation: 一种用于电子组装方法的组合物，所述组合物包含分散在有机介质中的填料，其中：所述有机介质包含聚合物; 填料包括一个或多个石墨烯，官能化石墨烯，氧化石墨烯，多面体低聚倍半硅氧烷，石墨，二维材料，氧化铝，氧化锌，氮化铝，氮化硼，银，纳米纤维，碳纤维，金刚石，碳纳米管 ，二氧化硅和金属涂覆的颗粒，并且所述组合物包含基于组合物总重量的0.001至40重量％的填料。

公开(公告)号：WO2020002890A1

公开(公告)日：2020-01-02

申请号：PCT/GB2019/051768

申请日：2019-06-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC. ,  ROHAN SETNA

Inventor： GHOSAL, Shamik ,  CHANDRAN, Remya ,  MANOHARAN, Venodh ,  SARKAR, Siuli ,  SINGH, Bawa ,  RAUT, Rahul

IPC: B22F1/00 ,  B22F9/24 ,  B23K35/02

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

公开(公告)号：WO2015103362A1

公开(公告)日：2015-07-09

申请号：PCT/US2014/072936

申请日：2014-12-31

Applicant: ALPHA METALS, INC. ,  RIBAS, Morgana, De Avila ,  RAUT, Rahul ,  CUCU, Traian, Cornel ,  YONG, Shu, Tai

Inventor： RIBAS, Morgana, De Avila ,  RAUT, Rahul ,  CUCU, Traian, Cornel ,  YONG, Shu, Tai ,  SARKAR, Siuli ,  VENKATAGIRIYAPPA, Ramakrishna, Hosur

IPC: B23K35/362

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H05K1/09 ,  H05K1/111 ,  H05K9/0024 ,  H05K2201/032

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Abstract translation: 无松动的热固性助焊剂配方，用于增强焊点的机械可靠性。 根据一个或多个方面，本文所示和描述的焊膏赋予与液滴冲击，热循环，热冲击，剪切强度，弯曲强度性能和/或其它热量中的至少一种相关的改进或增强的焊点性能 机械性能属性。

公开(公告)号：WO2015017615A1

公开(公告)日：2015-02-05

申请号：PCT/US2014/049046

申请日：2014-07-31

Applicant: ALPHA METALS, INC.

Inventor： VENKATAGIRIYAPPA, Ramakrishna, Hosur ,  MUKHERJEE, Sutapa ,  SIDDAPPA, Harish, Hanchina ,  RIBAS, Morgana, De Avila ,  SARKAR, Siuli ,  SINGH, Bawa ,  RAUT, Rahul

IPC: H01L21/48

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L22/12 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/0133 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

Abstract translation: 双边加固（DSR）材料和半导体制造方法。 DSR材料表现出常规底层填充材料的性能，在室温下具有增强的稳定性。

公开(公告)号：WO2015072974A1

公开(公告)日：2015-05-21

申请号：PCT/US2013/069672

申请日：2013-11-12

Applicant: ALPHA METALS, INC.

Inventor： PUJARI, Narahari ,  ARORA, Sanyogita ,  SARKAR, Siuli ,  LIFTON, Anna ,  RAUT, Rahul ,  SINGH, Bawa

IPC: B23K31/02 ,  B23K35/36

CPC classification number: H05K3/3489 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/282 ,  H05K3/3478 ,  H05K2201/0133 ,  H05K2203/0514

Abstract: Flux formulations that remain pliable and tack- free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

Abstract translation: 公开了在沉积后保持柔韧性和粘性的助焊剂制剂。 在某些实例中，焊剂包括第一组分和有效量的第二组分，以在沉积后提供柔韧的焊剂。 助熔剂还可以包括活化剂，增塑剂，表面活性剂和其它组分。

公开(公告)号：WO2015028813A1

公开(公告)日：2015-03-05

申请号：PCT/GB2014/052623

申请日：2014-08-29

Applicant: ALPHA METALS, INC. ,  SETNA, Rohan P

Inventor： PANDHER, Ranjit ,  SINGH, Bawa ,  RAUT, Rahul ,  SANYOGITA, Arora ,  BHATKAL, Ravindra ,  MO, Bin

IPC: B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  B23K35/02

CPC classification number: B23K35/3612 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  C22C13/00

Abstract: A flux comprising one or more amines.

Abstract translation: 包含一种或多种胺的助熔剂。

公开(公告)号：WO2014068299A1

公开(公告)日：2014-05-08

申请号：PCT/GB2013/052817

申请日：2013-10-29

Applicant: ALPHA METALS, INC. ,  SETNA, Rohan

Inventor： PANDHER, Ranjit ,  KHASELEV, Oscar ,  BHATKAL, Ravi ,  RAUT, Rahul ,  SINGH, Bawa ,  RIBAS, Morgana ,  GHOSAL, Shamik ,  SARKAR, Siuli ,  MUKHERJEE, Sutapa ,  KUMAR, Sathish ,  CHANDRAN, Remya ,  VISHWANATH, Pavan ,  PACHAMUTHU, Ashok ,  BOUREGHDA, Monnir ,  DESAI, Nitin ,  LIFTON, Anna ,  CHAKI, Nirmalya Kumar

IPC: C01G5/00 ,  B22F1/00 ,  B22F7/08 ,  B22F9/24 ,  C09C1/62 ,  C09C3/08 ,  C21C1/04

CPC classification number: C09K5/14 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/02 ,  B22F2001/0066 ,  B82Y30/00 ,  C01G5/00 ,  C01P2002/72 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2004/53 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/22 ,  C01P2006/32 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.

Abstract translation: 一种烧结粉末，其包含：平均最大直径小于10微米的颗粒，其中形成颗粒的至少一些颗粒包含至少部分涂覆有覆盖剂的金属。