Invention Application
WO2017039962A1 INTEGRATION OF INDUCTORS WITH ADVANCED-NODE SYSTEM-ON-CHIP (SOC) USING GLASS WAFER WITH INDUCTORS AND WAFER-TO-WAFER JOINING
审中-公开
使用带有电感器的玻璃波形和波形到波长接合的电感器与高级节点系统芯片（SOC）的集成
- Patent Title: INTEGRATION OF INDUCTORS WITH ADVANCED-NODE SYSTEM-ON-CHIP (SOC) USING GLASS WAFER WITH INDUCTORS AND WAFER-TO-WAFER JOINING
- Patent Title (中): 使用带有电感器的玻璃波形和波形到波长接合的电感器与高级节点系统芯片（SOC）的集成
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Application No.: PCT/US2016/045998Application Date: 2016-08-08
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Publication No.: WO2017039962A1Publication Date: 2017-03-09
- Inventor: ARABI, Karim , SHENOY, Ravindra Vaman , GOUSEV, Evgeni Petrovich , ERTURK, Mete
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Agency: CICCOZZI, John L. et al.
- Priority: US14/843,964 20150902
- Main IPC: H01L23/64
- IPC: H01L23/64 ; G06F1/32 ; H02M1/00
Abstract:
A voltage regulator having a coil inductor is integrated or embedded in a system-on-chip (SOC) device. The coil inductor is fabricated on an inductor wafer with through vias, and the inductor wafer is joined with an SOC wafer for integration with the SOC device.
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