公开(公告)号：WO2022020002A1

公开(公告)日：2022-01-27

申请号：PCT/US2021/033937

申请日：2021-05-24

Applicant: QUALCOMM INCORPORATED

Inventor： GRUHLKE, Russell ,  SHENOY, Ravindra Vaman ,  LASITER, Jon ,  KIDWELL, Donald William ,  ALAM, Khurshid Syed ,  LI, Kebin

IPC: H04N5/225 ,  G02B13/00

Abstract: An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.

公开(公告)号：WO2021173817A1

公开(公告)日：2021-09-02

申请号：PCT/US2021/019639

申请日：2021-02-25

Applicant: QUALCOMM INCORPORATED

Inventor： KIM, Jonghae ,  SHENOY, Ravindra Vaman ,  SHAH, Milind ,  GOUSEV, Evgeni ,  CHIDAMBARAM, Periannan

IPC: H01L23/64 ,  H01F17/00 ,  H01L23/498 ,  H01L25/16

Abstract: Reducing the space occupied by a voltage regulation integrated circuit (IC) that includes an inductor is achieved by implementing the inductor as a 3D inductor having windings formed of conductive elements integrated into a lower substrate, a circuit layer, and an upper substrate, and positioning other components within a core space of the 3D inductor in the circuit layer. The space occupied by the inductor is shared with the other circuit components and with the structural layers of the voltage regulation IC. A voltage regulation IC may be a switched-mode power supply (SMPS) that includes an inductor with a capacitor and/or a switching circuit. The inductor is implemented as upper horizontal traces in an upper substrate, lower horizontal traces in a lower substrate, and vertical interconnects in a circuit layer between the upper substrate and the lower substrate, and the conductive elements form the 3D inductor as a rectangular coil.

公开(公告)号：WO2017039962A1

公开(公告)日：2017-03-09

申请号：PCT/US2016/045998

申请日：2016-08-08

Applicant: QUALCOMM INCORPORATED

Inventor： ARABI, Karim ,  SHENOY, Ravindra Vaman ,  GOUSEV, Evgeni Petrovich ,  ERTURK, Mete

IPC: H01L23/64 ,  G06F1/32 ,  H02M1/00

CPC classification number: H01L28/10 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/645 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/16268 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19042 ,  H01L2924/19103

Abstract: A voltage regulator having a coil inductor is integrated or embedded in a system-on-chip (SOC) device. The coil inductor is fabricated on an inductor wafer with through vias, and the inductor wafer is joined with an SOC wafer for integration with the SOC device.

Abstract translation: 具有线圈电感器的电压调节器集成或嵌入到片上系统（SOC）器件中。 线圈电感器制造在具有通孔的电感器晶片上，并且电感器晶片与SOC晶片连接以与SOC器件集成。

公开(公告)号：WO2022187762A1

公开(公告)日：2022-09-09

申请号：PCT/US2022/070127

申请日：2022-01-10

Applicant: QUALCOMM INCORPORATED

Inventor： LASITER, Jon ,  SHENOY, Ravindra Vaman ,  SIVALINGAM, Ravishankar ,  GRUHLKE, Russell ,  KIDWELL, Donald William ,  ALAM, Khurshid Syed ,  LI, Kebin

IPC: H04N5/33 ,  H01L27/146 ,  H04N5/225

Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.

公开(公告)号：WO2017209897A1

公开(公告)日：2017-12-07

申请号：PCT/US2017/031394

申请日：2017-05-05

Applicant: QUALCOMM INCORPORATED

Inventor： SAMMOURA, Firas ,  FUNG, Stephanie ,  KIDWELL, Donald William, Jr. ,  SHENOY, Ravindra Vaman ,  BURNS, David William

IPC: G01C9/18 ,  G01C9/20

CPC classification number: G01C9/20 ,  G01C9/18 ,  G01F23/2965

Abstract: A device may include a surface at least partially defining an enclosed region, a plurality of fluids within the enclosed region, the plurality of fluids comprising at least a first fluid having a first acoustic impedance and a second fluid having a second acoustic impedance different from the first acoustic impedance, a first piezoelectric transducer disposed on the surface, the first piezoelectric transducer being configured to generate a first wave reception signal based, at least in part, on an ultrasonic return wave received through at least one of the plurality of fluids, and a processor coupled to the first piezoelectric transducer and configured to determine a measurement of a tilt of the device based, at least in part, on the first wave reception signal.

Abstract translation: 装置可以包括至少部分地限定封闭区域的表面，封闭区域内的多种流体，所述多种流体至少包括具有第一声阻抗的第一流体和具有第一声阻抗的第二流体， 具有与所述第一声阻抗不同的第二声阻抗;布置在所述表面上的第一压电换能器，所述第一压电换能器被配置为至少部分地基于通过至少部分地通过所述第一压电换能器接收的超声返回波而生成第一波接收信号， 所述多种流体中的一种流体以及处理器，所述处理器耦合到所述第一压电换能器并且被配置为至少部分地基于所述第一波接收信号来确定所述装置的倾斜的测量值。

公开(公告)号：WO2016007250A1

公开(公告)日：2016-01-14

申请号：PCT/US2015/034729

申请日：2015-06-08

Applicant: QUALCOMM INCORPORATED

Inventor： LASITER, Jon Bradley ,  SHENOY, Ravindra Vaman ,  GOUSEV, Evgeni Petrovich ,  PANCHAWAGH, Hrishikesh Vijaykumar ,  BURNS, David William ,  KUO, Nai-Kuei ,  GRIFFITHS, Jonathan Charles ,  GANTI, Suryaprakash

IPC: B06B1/06 ,  G06F3/043 ,  H01L41/09

CPC classification number: B06B1/0666 ,  B06B1/0622 ,  B06B1/0648 ,  B06B1/0651 ,  B06B1/067 ,  B06B1/0674 ,  B06B1/0677 ,  G06F3/043 ,  G06K9/0002 ,  H01L41/0973

Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.

Abstract translation: 压电微机械超声换能器（PMUT）包括设置在基板上的多层堆叠。 多层堆叠可以包括设置在衬底上的锚结构，设置在锚结构上的压电层堆叠，以及靠近压电层堆叠设置的机械层。 压电层堆叠可以设置在空腔上。 机械层可以密封空腔，并且与压电层堆叠一起由锚结构支撑并且在空腔上形成膜，该膜被配置为当PMUT接收或传输时经历挠曲运动和振动中的一个或两个 超声信号。

公开(公告)号：WO2015120375A1

公开(公告)日：2015-08-13

申请号：PCT/US2015/014995

申请日：2015-02-09

Applicant: QUALCOMM INCORPORATED

Inventor： YUN, Changhan Hobie ,  KIM, Daeik Daniel ,  ZUO, Chengjie ,  KIM, Jonghae ,  VELEZ, Mario Francisco ,  KIDWELL, JR., Donald William ,  LASITER, Jon Bradley ,  LAI, Kwan-Yu ,  KIM, Jitae ,  SHENOY, Ravindra Vaman

IPC: H01L49/02 ,  H01G4/33 ,  H01G4/012 ,  H01L21/48 ,  H01L27/12

CPC classification number: H01L28/90 ,  H01G4/012 ,  H01G4/33 ,  H01L21/28282 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5223 ,  H01L27/0805 ,  H01L27/12 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.

Abstract translation: 提供的空间效率电容器具有比传统设计更高的品质因数，并且改善了从直通玻璃通孔（TGV）到电介质的电能的耦合。 例如，提供了具有非矩形横截面的TGV，其中TGV的一端耦合到第一金属板。 在第一金属板上形成电介质材料。 第二金属板以与第一金属板的至少一部分重叠以形成电介质材料的至少一个重叠区域的方式形成在电介质材料上。 重叠区域的周边的至少一部分是非平面的。 重叠区域可以形成为环形的多个部分中的大致四分之一环形的闭环形状和/或大致一半的环形形状。

公开(公告)号：WO2019108360A1

公开(公告)日：2019-06-06

申请号：PCT/US2018/059726

申请日：2018-11-08

Applicant: QUALCOMM INCORPORATED

Inventor： KIDWELL JR., Donald William ,  SHENOY, Ravindra Vaman ,  LEWIS, Alan ,  FERGUSON, Christopher Feuling

IPC: H01L49/02 ,  H01L23/522 ,  H01L23/64 ,  H01F17/00 ,  H01F41/04

Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.

公开(公告)号：WO2019055178A1

公开(公告)日：2019-03-21

申请号：PCT/US2018/047266

申请日：2018-08-21

Applicant: QUALCOMM INCORPORATED

Inventor： SAMMOURA, Firas ,  BURNS, David William ,  SHENOY, Ravindra Vaman

IPC: A61N1/378

CPC classification number: A61B8/12 ,  A61B6/4057 ,  A61B8/0808 ,  A61B2562/028 ,  A61N1/3787 ,  B06B1/0292 ,  B06B1/064 ,  G01S15/8918 ,  G01S15/895

Abstract: An apparatus may include an array of piezoelectric micromachined ultrasonic transducers (PMUTs) and a control system configured to communicate with the array of PMUTs. The control system may be configured to determine a target location within a human body and to control the array of PMUTs to focus ultrasonic waves at the target location.

公开(公告)号：WO2019005344A1

公开(公告)日：2019-01-03

申请号：PCT/US2018/034214

申请日：2018-05-23

Applicant: QUALCOMM INCORPORATED

Inventor： SAMMOURA, Firas ,  BURNS, David William ,  SHENOY, Ravindra Vaman

IPC: G06K9/00 ,  G06F3/041 ,  G06F3/043

Abstract: Implementations of the subject matter described herein relate to sensors including piezoelectric micromechanical ultrasonic transducer (PMUT) sensor elements and arrays thereof. The PMUT sensor elements may be switchable between a non- ultrasonic force detection mode and an ultrasonic imaging mode. A PMUT sensor element may include a diaphragm that is capable of a static displacement on application of a force and is capable of a dynamic displacement when the PMUT sensor element transmits or receives ultrasonic signals. In some implementations, a PMUT sensor element includes a two dimensional-electron gas structure on the diaphragm. The sensors may further include a sensor controller configured to switch between a non- ultrasonic force detection mode and an ultrasonic imaging mode for one or more of the PMUT sensor elements, wherein an applied force is measured in the non-ultrasonic force detection mode and wherein an object is imaged ultrasonically during the ultrasonic imaging mode.