A method for manufacturing a back-contact solar cell, comprising the steps of: (i) preparing a semiconductor substrate comprising an n-layer and a p-layer at the back side of the semiconductor substrate; (ii) applying a conductive paste on both the n-layer and the p-layer, wherein the conductive paste comprises a silver (Ag) powder, a palladium (Pd) powder, an additional metal powder selected from the group consisting of molybdenum (Mo), boron (B) and a mixture thereof, a glass frit, and an organic medium; and (iii) firing the applied conductive paste.