公开(公告)号：WO2016043963A1

公开(公告)日：2016-03-24

申请号：PCT/US2015/047846

申请日：2015-09-01

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： DORFMAN, Jay Robert

IPC: H01B1/22 ,  C09D171/00 ,  C09D175/04 ,  C08L71/00 ,  C08L75/04 ,  H01B3/30 ,  H01L23/29

CPC classification number: H01B1/20 ,  C08G2650/56 ,  C08J7/045 ,  C08J2369/00 ,  C08J2375/04 ,  C08J2475/04 ,  C08K3/20 ,  C08K3/2279 ,  C08K2003/2231 ,  C08L71/00 ,  C08L71/02 ,  C08L75/04 ,  C09D5/24 ,  C09D171/00 ,  C09D175/04 ,  H01B1/22

Abstract: This invention is directed to a polymer thick film transparent conductor composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film transparent conductor composition. The electrical circuit may be subsequently subjected to an injection molding process.

Abstract translation: 本发明涉及一种聚合物厚膜透明导体组合物，其可用于发生基底衬底的热成型的应用中，例如电容开关中。 聚碳酸酯基材通常用作基材，并且可以使用聚合物厚膜导电组合物而没有任何阻挡层。 根据具体设计，可热成型的透明导体可以在可热成形的银导体的下面或顶部。 可热成型电路从干燥的聚合物厚膜透明导体组合物上存在密封剂层获益。 电路可以随后进行注射成型工艺。

公开(公告)号：WO2016010744A1

公开(公告)日：2016-01-21

申请号：PCT/US2015/039012

申请日：2015-07-02

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： DORFMAN, Jay, Robert

IPC: H01B1/22 ,  H05K1/09 ,  B05D5/12 ,  C08K3/08 ,  C09D127/16 ,  C08L27/16

CPC classification number: C09D5/24 ,  C08K3/08 ,  C08K2003/0806 ,  C09D11/52 ,  C09D127/16 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0245 ,  C08L27/16 ,  C08K13/02 ,  C08K5/521

Abstract: This invention is directed to a polymer thick film conductor composition that provides a better conductor when dried at 80°C than when dried at 130°C, in contrast to typical PTF conductors. More specifically, the polymer thick film conductor may be used in applications where low temperature curing is required.

Abstract translation: 本发明涉及一种聚合物厚膜导体组合物，与典型的PTF导体相比，在80℃干燥时比在130℃干燥时提供更好的导体。 更具体地说，聚合物厚膜导体可以用于需要低温固化的应用中。

公开(公告)号：WO2016007268A1

公开(公告)日：2016-01-14

申请号：PCT/US2015/036412

申请日：2015-06-18

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： DORFMAN, Jay Robert

IPC: C08L71/00 ,  C08L75/06 ,  C08L63/00

CPC classification number: H01G4/14 ,  C08G2650/56 ,  C08K3/10 ,  C08K2003/2237 ,  C08L63/00 ,  C08L71/00 ,  C08L75/04 ,  C08L75/06 ,  H01B3/12 ,  H01B3/302 ,  H01B3/307 ,  H01G4/008

Abstract: This invention is directed to a polymer thick film thermoformable dielectric composition with a high dielectric constant, comprising a urethane resin, a phenoxy resin and a powder with a high dielectric constant. Dielectrics made from the composition can be used in various electronic applications to enhance the performance of thermoformable capacitive circuits.

Abstract translation: 本发明涉及具有高介电常数的聚合物厚膜可热成形的电介质组合物，其包含聚氨酯树脂，苯氧树脂和具有高介电常数的粉末。 由组合物制成的电介质可用于各种电子应用中，以增强可热成型的电容电路的性能。

公开(公告)号：WO2015191955A2

公开(公告)日：2015-12-17

申请号：PCT/US2015/035480

申请日：2015-06-12

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： ROGOJINA, Elena ,  WANG, Gonghou ,  TAI, Elizabeth ,  KELMAN, Maxim

CPC classification number: H01L31/0224 ,  B23K35/025 ,  B23K35/262 ,  B23K35/288 ,  C22C13/00 ,  C22C21/003 ,  H01B1/023

Abstract: The present invention is directed to a paste composition comprising Al and Sn dispersed in an organic medium and to paste compositions that provide a solderable electrode. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The paste compositions that provide a solderable electrode are particularly useful for forming a solar cell back side solderable electrode.

Abstract translation: 本发明涉及一种包含分散在有机介质中的Al和Sn和提供可焊接电极的组合物的糊料组合物。 本发明还涉及由糊料组合物和半导体器件形成的电极，特别是包括这种电极的太阳能电池。 提供可焊接电极的糊剂组合物特别可用于形成太阳能电池背面可焊接电极。

公开(公告)号：WO2015142830A1

公开(公告)日：2015-09-24

申请号：PCT/US2015/020937

申请日：2015-03-17

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： DORFMAN, Jay Robert

IPC: H01B1/22 ,  C08L71/00 ,  C08L75/04 ,  H03K17/96 ,  H05K1/09

CPC classification number: C09D11/52 ,  C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08L71/00 ,  C08L75/04 ,  H01B1/22 ,  H03K17/962 ,  H03K2217/960785 ,  H05K1/095 ,  H05K1/16 ,  H05K2201/0108 ,  H05K2201/0129

Abstract: This invention is directed to a polymer thick film transparent conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.

Abstract translation: 本发明涉及一种聚合物厚膜透明导电组合物，其可用于其中发生基础衬底的热成形的应用中，例如在电容式开关中。 经常使用聚碳酸酯基材作为基材，并且聚合物厚膜导电组合物可以在没有任何阻隔层的情况下使用。 根据具体设计，可热成型透明导体可能位于可热成型银导体的下方或顶部。 可热成形的电路受益于干燥的聚合物厚膜导电组合物上方的密封剂层的存在。 电路随后经受注塑工艺。

公开(公告)号：WO2015073654A1

公开(公告)日：2015-05-21

申请号：PCT/US2014/065425

申请日：2014-11-13

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： CRITZER, Mark Steven ,  DORFMAN, Jay Robert

IPC: H01B1/22 ,  C09D171/00 ,  C09D175/00

CPC classification number: H05K1/038 ,  B05D5/12 ,  C08L75/04 ,  C09D171/00 ,  C09D175/00 ,  C09D175/04 ,  H01B1/22 ,  H01B13/30 ,  C08L71/02

Abstract: This invention is directed to a polymer thick film conductor composition. The polymer thick film (PTF) conductor composition may be used in applications where significant stretching is required, particularly on highly permeable substrates. A particular type of substrate which is suitable is a woven polyester coated with polyamide. An electrical circuit containing a conductor formed from the composition and a process to make such a circuit are provided.

Abstract translation: 本发明涉及聚合物厚膜导体组合物。 聚合物厚膜（PTF）导体组合物可用于需要显着拉伸的应用中，特别是在高度可渗透的基底上。 适合的特定类型的基材是涂覆有聚酰胺的编织聚酯。 提供了包含由该组合物形成的导体的电路和制造这种电路的工艺。

公开(公告)号：WO2014052253A2

公开(公告)日：2014-04-03

申请号：PCT/US2013/061267

申请日：2013-09-24

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： LAUGHLIN, Brian, J. ,  WANG, Yueli ,  PALANDUZ, Cengiz, Ahmet ,  SUESS, Terry, Roland

IPC: H01L31/0224

CPC classification number: H01L31/02245 ,  C08K2003/0806 ,  C09D5/24 ,  C09D17/002 ,  C09D17/006 ,  C09D17/007 ,  C09D17/008 ,  H01B1/22 ,  H01L35/14 ,  Y02E10/50

Abstract: A conductive silver via paste comprising particulate conductive silver, a vanadium-phosphorus-oxide and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive silver paste.

Abstract translation: 包含微粒导电银，钒 - 磷 - 氧化物和有机载体的导电银通孔糊剂特别用于在MWT太阳能电池的硅晶片中提供空穴的金属化。 其结果是太阳能电池前侧的集电极线与背侧的发射极电极之间的金属导电通路。 糊剂还可用于在太阳能电池的正面形成集电极线，并在太阳能电池的背面形成发射极电极。 还公开了包含烧制的导电银浆的金属包裹硅太阳能电池。

公开(公告)号：WO2013085961A1

公开(公告)日：2013-06-13

申请号：PCT/US2012/067885

申请日：2012-12-05

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： WANG, Yueli ,  HANG, Kenneth, Warren

IPC: C03C8/12 ,  C03C8/16 ,  C03C8/18 ,  H01B1/02 ,  C03C8/20

CPC classification number: H01L31/0272 ,  C03C3/07 ,  C03C3/122 ,  C03C3/142 ,  C03C3/21 ,  C03C8/12 ,  C03C8/16 ,  C03C8/18 ,  C03C8/20 ,  H01B1/22 ,  H01L31/022425 ,  H01L31/02245 ,  Y02E10/50

Abstract: A conductive silver via paste comprising particulate conductive silver, a lead-tellurium-lithium-titanium-oxide, titanium resinate and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive silver paste.

Abstract translation: 包含颗粒状导电性银，铅 - 碲 - 锂 - 氧化钛，树脂钛酸盐和有机载体的导电性银通过糊剂特别可用于提供MWT太阳能电池的硅晶片中的孔的金属化。 结果是在前侧的集电极线与太阳能电池背面的发射极之间的金属导电通孔。 该糊料也可用于在太阳能电池的正面和太阳能电池背面的发射电极上形成收集线。 还公开了包括烧结的导电银浆的金属包裹硅太阳能电池。

公开(公告)号：WO2013025648A1

公开(公告)日：2013-02-21

申请号：PCT/US2012/050658

申请日：2012-08-13

Applicant: E. I. du Pont de Nemours and Company ,  VERNOOY, Paul Douglas ,  KIKUCHI, Chieko ,  OZAWA, Kazutaka

Inventor： VERNOOY, Paul Douglas ,  KIKUCHI, Chieko ,  OZAWA, Kazutaka

IPC: H01B1/22

CPC classification number: H01B1/22

Abstract: The present invention is directed to an electrically conductive composition comprising (i) an electrically conductive metal, (ii) a component selected from the group consisting of Li 2 RuO 3, ion-exchanged Li 2 RuO 3 and mixtures thereof, and (iii) a glass frit all dispersed in an organic medium. The present invention is further directed to an electrode formed from the composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The electrodes provide good adhesion and good electrical performance.

Abstract translation: 本发明涉及一种导电组合物，其包含（i）导电金属，（ii）选自Li 2 RuO 3，离子交换的Li 2 RuO 3及其混合物的组分，和（iii）全部分散在 有机介质。 本发明还涉及由组合物和半导体器件形成的电极，特别是包括这种电极的太阳能电池。 电极提供良好的附着力和良好的电气性能。

公开(公告)号：WO2012167075A1

公开(公告)日：2012-12-06

申请号：PCT/US2012/040452

申请日：2012-06-01

Applicant: E. I. du Pont de Nemours and Company ,  DORFMAN, Jay, Robert

Inventor： DORFMAN, Jay, Robert

IPC: H01B1/22

CPC classification number: H01L31/022433 ,  H01B1/22 ,  H01L31/022425 ,  Y02E10/50

Abstract: The invention is directed to a polymer thick film conductive composition comprising (a) a conductive silver-coated copper powder; and (b) an organic medium comprising two different resins and organic solvent, wherein the ratio of the weight of the conductive silver-coated copper powder to the total weight of the two different resins is between 5:1 and 45:1. The invention is further directed to a method of electrode grid and/or bus bar formation on thin-film photovoltaic cells using the composition and to cells formed from the method and the composition.

Abstract translation: 本发明涉及一种聚合物厚膜导电组合物，其包含（a）导电的银包覆铜粉末; 和（b）包含两种不同树脂和有机溶剂的有机介质，其中导电银涂覆铜粉末的重量与两种不同树脂的总重量之比在5:1至45:1之间。 本发明还涉及使用该组合物和由该方法和组合物形成的细胞在薄膜光伏电池上形成电极栅极和/或母线的方法。