Invention Application
- Patent Title: MULTILAYER STRUCTURE FOR REDUCING FILM ROUGHNESS IN MAGNETIC DEVICES
- Patent Title (中): 多层结构减小磁性器件的膜厚
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Application No.: PCT/US2016/058449Application Date: 2016-10-24
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Publication No.: WO2017091310A1Publication Date: 2017-06-01
- Inventor: ZHU, Jian , JAN, Guenole , LEE, Yuan-Jen , LIU, Huanlong , TONG, Ru-Ying , WANG, Po-Kang
- Applicant: HEADWAY TECHNOLOGIES, INC.
- Applicant Address: 678 South Hillview Drive Milpitas, CA 95035 US
- Assignee: HEADWAY TECHNOLOGIES, INC.
- Current Assignee: HEADWAY TECHNOLOGIES, INC.
- Current Assignee Address: 678 South Hillview Drive Milpitas, CA 95035 US
- Agency: ACKERMAN, Stephen, B.
- Priority: US14/949,232 20151123
- Main IPC: H01L43/08
- IPC: H01L43/08 ; H01F10/16 ; H01F10/32 ; H01L43/12
Abstract:
A seed layer stack (24) with a smooth top surface having a peak to peak roughness of 0.5 nm is formed by sputter depositing an amorphous layer (22) on a seed layer (21) such as Mg where the seed layer has a resputtering rate 2 to 30X that of the amorphous layer. The uppermost seed layer (23) is a template layer that is NiCr or NiFeCr. As a result, perpendicular magnetic anisotropy in an overlying magnetic layer that is a reference layer, free layer, or dipole layer is substantially maintained during high temperature processing up to 400°C and is advantageous for magnetic tunnel junctions in embedded MRAMs, spintronic devices, or in read head sensors. The amorphous seed layer is SiN, TaN, or CoFeM where M is B or another element with a content that makes CoFeM amorphous as deposited. The seed layer stack may include a bottommost Ta or TaN buffer layer.
Information query
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