Invention Application
WO2017125947A1 A THERMO-LAMINATED MULTILAYERED ZIRCON BASED HIGH TEMPERATURE CO-FIRED CERAMIC (HTCC) TAPE AND THE PROCESS THEREOF
审中-公开
热层叠多层陶瓷基高温共烧陶瓷（HTCC）带及其制备方法
- Patent Title: A THERMO-LAMINATED MULTILAYERED ZIRCON BASED HIGH TEMPERATURE CO-FIRED CERAMIC (HTCC) TAPE AND THE PROCESS THEREOF
- Patent Title (中): 热层叠多层陶瓷基高温共烧陶瓷（HTCC）带及其制备方法
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Application No.: PCT/IN2017/050014Application Date: 2017-01-10
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Publication No.: WO2017125947A1Publication Date: 2017-07-27
- Inventor: SURENDRAN, Kuzhichalil Peethambharan , SEBASTIAN, Mailadil Thomas , VARGHESE, Jobin
- Applicant: COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH
- Applicant Address: Anusandhan Bhawan, 2 Rafi Marg New Delhi 110001 IN
- Assignee: COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH
- Current Assignee: COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH
- Current Assignee Address: Anusandhan Bhawan, 2 Rafi Marg New Delhi 110001 IN
- Agency: PHILLIPS, Prashant et al.
- Priority: IN201611001838 20160119
- Main IPC: B32B18/00
- IPC: B32B18/00 ; C04B35/48 ; C04B35/626 ; C04B35/632 ; C04B35/634 ; H01L23/498
Abstract:
The present invention provides a low cost preparation of ultra-low CTE and low dielectric loss high temperature co-fired ceramic (HTCC) substrates for highly integrated monolithic millimeter-wave integrated circuits (MMICs) utilized in high temperature environment. This HTCC zircon substrate is advantageous over currently available HTCC substrates in terms of cost effectiveness, excellent dielectric properties, close to zero thermal expansively, high thermal conductivity and good mechanical properties.
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