Abstract:
The present invention relates to self healing silica based dielectric ink for printed electronic applications. Novel self healing silica based dielectric ink screen printable on flexible substrates is indigenously developed for printed electronic applications. The silica ink consist of solvent system (Xylene/Ethanol), a filler (55 - 65 wt. % of SiO2 with respect to solvent system), a dispersant (0.8 - 1.2 wt. % of natural fish oil with respect to filler) and a binder (4 - 6 wt. % of Polyvinyl Butyral with respect to filler). The colloidal ink comprises of silica as the major filler with suitable organic vehicles. The present invention of silica ink is advantageous over water based dielectric inks in terms of faster curing time. Thixotropic behavior of the colloidal silica ink is optimized based on screen printing technique. Solvent mixture, natural dispersant, polymer binder etc. played a key role in controlling the colloidal stability of the ink. The microstructure and surface roughness of printed dielectric silica ink on Mylar film was investigated. The radio and microwave dielectric properties are also investigated for the optimized silica ink. The best dielectric properties, fast curing and printability of the developed silica ink make it a suitable candidate for dye-sensitized solar cell applications also.
Abstract:
The present invention provides a low cost preparation of ultra-low CTE and low dielectric loss high temperature co-fired ceramic (HTCC) substrates for highly integrated monolithic millimeter-wave integrated circuits (MMICs) utilized in high temperature environment. This HTCC zircon substrate is advantageous over currently available HTCC substrates in terms of cost effectiveness, excellent dielectric properties, close to zero thermal expansively, high thermal conductivity and good mechanical properties.
Abstract:
The present invention provides a low cost preparation of ultra-low CTE and low dielectric loss high temperature co-fired ceramic (HTCC) substrates for highly integrated monolithic millimeter-wave integrated circuits (MMICs) utilized in high temperature environment. This HTCC zircon substrate is advantageous over currently available HTCC substrates in terms of cost effectiveness, excellent dielectric properties, close to zero thermal expansively, high thermal conductivity and good mechanical properties.