Invention Application
- Patent Title: GEL-TYPE THERMAL INTERFACE MATERIAL
- Patent Title (中): 凝胶型热界面材料
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Application No.: PCT/US2017/041498Application Date: 2017-07-11
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Publication No.: WO2018022293A2Publication Date: 2018-02-01
- Inventor: ZHANG, Liqiang , DUAN, Huifeng , ZHANG, Kai , LIU, YaQun , SHEN, Ling , WANG, Wei Jun , KANG, Haigang
- Applicant: HONEYWELL INTERNATIONAL INC.
- Applicant Address: Intellectual Property-Patent Services 115 Tabor Road, M/S 4D3 P. O. Box 377 Morris Plains, New Jersey 07950 US
- Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee Address: Intellectual Property-Patent Services 115 Tabor Road, M/S 4D3 P. O. Box 377 Morris Plains, New Jersey 07950 US
- Agency: SZUCH, Colleen D.
- Priority: US62/366,704 20160726; US62/436,746 20161220; US15/642,082 20170705
- Main IPC: H01L23/373
- IPC: H01L23/373
Abstract:
A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
Public/Granted literature
- WO2018022293A3 GEL-TYPE THERMAL INTERFACE MATERIAL Public/Granted day:2018-02-01
Information query
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