Abstract:
A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
Abstract:
Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si-O-Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si-O-Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si-O-Si linkages, wherein the linking portion is of a formula selected from the group consisting of: -[CH 2 ] a - where a is an integer from 1 to 10 and -[CH 2 ] b CONH[CH 2 ] c - where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.
Abstract:
Disclosed is a paper battery that includes a cellulosic substrate having absorbed thereon an electrolyte material and first and second barrier substrates disposed on opposite sides of the cellulosic substrate. Each of the first and second barrier substrates have an electrode printed thereon. At least one of the first and second barrier substrates includes first and second polymer layers. Further disclosed is a method of manufacturing a paper battery that includes the steps of absorbing an electrolyte material onto a cellulosic substrate and disposing on opposite sides of the cellulosic substrate first and second barrier substrates. Each of the first and second barrier substrates have an electrode printed thereon. At least one of the first and second barrier substrates includes first and second polymer layers.
Abstract:
A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
Abstract:
A thermal Interface material includes at least one polysiloxane; at least one thermally conductive filler; and at least one adhesion promoter including both amine and alkyl functional groups.
Abstract:
A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
Abstract:
Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
Abstract:
A thermal Interface material includes at least one polysiloxane; at least one thermally conductive filler; and at least one adhesion promoter including both amine and alkyl functional groups.
Abstract:
A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80wt.% of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
Abstract:
Composite phase change materials, methods for manufacturing composite phase change materials, and articles of clothing including composite phase change materials for temperature regulation are provided. In one example, a composite phase change material includes a cross-linked polyethylene glycol matrix and a phase change material filler. Each of the cross-linked polyethylene glycol matrix and the phase change material filler has a phase change temperature of from about 10 to about 60 °C. Further, the composite phase change material has a latent heat of enthalpy greater than about 50 kJ/kg.