Invention Application
- Patent Title: STRETCHABLE AND FLEXIBLE ELECTRICAL SUBSTRATE INTERCONNECTIONS
- Patent Title (中): 可伸缩和灵活的电子基板互连
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Application No.: PCT/US2017/046014Application Date: 2017-08-09
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Publication No.: WO2018052581A1Publication Date: 2018-03-22
- Inventor: BAXI, Amit Sudhir , MAGESHKUMAR, Vincent S. , ELSHERBINI, Adel A. , OSTER, Sasha N. , EID, Feras , ALEKSOV, Aleksandar , SWAN, Johanna M.
- Applicant: INTEL CORPORATION
- Applicant Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Agency: PERDOK, Monique M. et al.
- Priority: US15/267,872 20160916
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14
Abstract:
A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.
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