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    HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
    1.
    发明申请
    HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING 审中-公开

    公开(公告)号：WO2022132274A1

    公开(公告)日：2022-06-23

    申请号：PCT/US2021/051906

    申请日：2021-09-24

    Applicant: INTEL CORPORATION

    Inventor： ALEKSOV, Aleksandar ,  KABIR, Mohammad Enamul ,  ELSHERBINI, Adel A. ,  LIFF, Shawna M. ,  SWAN, Johanna M. ,  EID, Feras

    IPC: H01L25/16 ,  H01L23/538 ,  H01L23/522 ,  H01L23/00 ,  H01L23/29

    Abstract: Disclosed herein are microelectronic assemblies including microelectronic components coupled by direct bonding, and related structures and techniques. In some embodiments, a microelectronic assembly may include a first microelectronic component including a first guard ring extending through at least a portion of a thickness of and along a perimeter; a second microelectronic component including a second guard ring extending through at least a portion of a thickness of and along a perimeter, where the first and second microelectronic components are coupled by direct bonding; and a seal ring formed by coupling the first guard ring to the second guard ring. In some embodiments, a microelectronic assembly may include a microelectronic component coupled to an interposer that includes a first liner material at a first surface; a second liner material at an opposing second surface; and a perimeter wall through the interposer and connected to the first and second liner materials.

    REDUCED DISPERSION DIELECTRIC WAVEGUIDES
    3.
    发明申请
    REDUCED DISPERSION DIELECTRIC WAVEGUIDES 审中-公开

    公开(公告)号：WO2019221885A1

    公开(公告)日：2019-11-21

    申请号：PCT/US2019/029032

    申请日：2019-04-25

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  BRAUNISCH, Henning ,  SWAN, Johanna M.

    IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00

    Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.

    MICROELECTRONIC ASSEMBLIES
    4.
    发明申请
    MICROELECTRONIC ASSEMBLIES 审中-公开

    公开(公告)号：WO2019132971A1

    公开(公告)日：2019-07-04

    申请号：PCT/US2017/068921

    申请日：2017-12-29

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel A. ,  LIFF, Shawna M. ,  SWAN, Johanna M. ,  CHANDRASEKHAR, Arun

    IPC: H01L25/065 ,  H01L25/07 ,  H01L23/485

    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

    MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
    5.
    发明申请
    MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS 审中-公开

    公开(公告)号：WO2019132966A1

    公开(公告)日：2019-07-04

    申请号：PCT/US2017/068914

    申请日：2017-12-29

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel A. ,  ELSHAZLY, Amr ,  CHANDRASEKHAR, Arun ,  LIFF, Shawna M. ,  SWAN, Johanna M.

    IPC: H01L25/065 ,  H01L23/12 ,  H01L23/48

    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

    SUPERCONDUCTING QUBIT DEVICE PACKAGES
    8.
    发明申请
    SUPERCONDUCTING QUBIT DEVICE PACKAGES 审中-公开

    公开(公告)号：WO2018125026A1

    公开(公告)日：2018-07-05

    申请号：PCT/US2016/068629

    申请日：2016-12-27

    Applicant: INTEL CORPORATION

    Inventor： ROBERTS, Jeanette M. ,  ELSHERBINI, Adel A. ,  LIFF, Shawna ,  SWAN, Johanna M. ,  CAUDILLO, Roman ,  YOSCOVITS, Zachary R. ,  THOMAS, Nicole K. ,  PILLARISETTY, Ravi ,  GEORGE, Hubert C. ,  CLARKE, James S.

    IPC: G06N99/00 ,  B82Y10/00

    Abstract: One superconducting qubit device package disclosed herein includes a die having a first face and an opposing second face, and a package substrate having a first face and an opposing second face. The die includes a quantum device including a plurality of superconducting qubits and a plurality of resonators on the first face of the die, and a plurality of conductive pathways coupled between conductive contacts at the first face of the die and associated ones of the plurality of superconducting qubits or of the plurality of resonators. The second face of the package substrate also includes conductive contacts. The device package further includes first level interconnects disposed between the first face of the die and the second face of the package substrate, coupling the conductive contacts at the first face of the die with associated conductive contacts at the second face of the package substrate.

    ELECTRICAL CONNECTORS FOR HIGH DENSITY ATTACH TO STRETCHABLE BOARDS
    9.
    发明申请
    ELECTRICAL CONNECTORS FOR HIGH DENSITY ATTACH TO STRETCHABLE BOARDS 审中-公开
    用于高密度安装在可拉伸板上的电连接器

    公开(公告)号：WO2018063675A1

    公开(公告)日：2018-04-05

    申请号：PCT/US2017/049159

    申请日：2017-08-29

    Applicant: INTEL CORPORATION

    Inventor： OSTER, Sasha N. ,  ELSHERBINI, Adel A. ,  EID, Feras ,  ALEKSOV, Aleksandar ,  BAXI, Amit Sudhir ,  SWAN, Johanna M. ,  MAGESHKUMAR, Vincent S.

    IPC: H01R13/629 ,  A44B19/24

    CPC classification number: H01R4/58 ,  A44B17/0041 ,  A44B19/24 ,  H01R13/03 ,  H01R43/26

    Abstract: A system can include a first portion of a fabric fastener, a second portion of the fabric fastener, wherein the first portion and the second portion are configured to mechanically connect with each other and to resist separation from each other once connected, and wherein the first and second portions include a plurality of corresponding electrical contacts configured to form a plurality of individual electrical connections when the first portion is mechanically connected with the second portion.

    Abstract translation: 系统可以包括织物紧固件的第一部分，织物紧固件的第二部分，其中第一部分和第二部分被配置为彼此机械连接并且防止从每个部分分离 并且其中所述第一部分和所述第二部分包括多个对应的电触点，所述多个对应的电触点被配置为当所述第一部分与所述第二部分机械连接时形成多个单独的电连接。

    SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING INCREASED HUMAN PERCEPTION OF HAPTIC FEEDBACK SYSTEMS
    10.
    发明申请
    SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING INCREASED HUMAN PERCEPTION OF HAPTIC FEEDBACK SYSTEMS 审中-公开
    用于实现增加的对感知反馈系统的感知的系统，方法和设备

    公开(公告)号：WO2018063417A1

    公开(公告)日：2018-04-05

    申请号：PCT/US2016/055086

    申请日：2016-10-01

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios C. ,  ALEKSOV, Aleksandar ,  SWAN, Johanna M.

    IPC: G06F1/16 ,  G06F3/01

    Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; in which one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

    Abstract translation: 根据所公开的实施例，提供了用于实现触觉反馈系统的增加的人类感知的系统，方法和装置。 例如，根据一个实施例公开了一种可穿戴设备，其中具有：可穿戴设备壳体; 可穿装置壳体内的多个致动器，每个致动器独立地或组合地振动; 其中所述多个致动器中的每一个的一个表面暴露在所述可穿装置壳体的表面处; 围绕可穿装置壳体内的多个致动器中的每一个的侧面的弹性体，以将致动器保持在可穿装置壳体内的适当位置; 以及从多个致动器中的每一个到可穿戴设备的内部半导体组件的电互连。 披露了其他相关的实施例。

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